Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Xavier Baraton"'
Autor:
Pandi C. Marimuthu, Yaojian Lin, Xavier Baraton, Yonggang Jin, Jerome Teysseyre, Seung Wook Yoon
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:001507-001526
Current and future demands of mobile/portable electronic systems in terms of performance, power consumption, reliable system at a reasonable price are met by developing advanced/appropriate silicon process technology, innovative packaging solutions w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d36f5961529ff937f8d71f5c4080fd1
https://doi.org/10.4071/2012dpc-wa22
https://doi.org/10.4071/2012dpc-wa22
Publikováno v:
Microelectronics Reliability. 50:1014-1020
Interface delamination during solder reflow is a critical reliability problem for the plastic IC packages. The main objective of this study is to apply modified virtual crack closure method (MVCCM) for the analysis of interface delamination between t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b1f7e9cfab531bb66f60ee66447b101a
https://doi.org/10.1016/j.microrel.2010.03.012
https://doi.org/10.1016/j.microrel.2010.03.012
Publikováno v:
Microelectronics Reliability. 43:741-749
In the flip-chip ball grid array (FCBGA) assembly process, no-flow underfill has the advantage over traditional capillary-flow underfill on shorter cycle time. Reliability tests are performed on both unmolded and molded FCBGA with three different typ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dec6ce38678e58bbc823113bad3a8224
https://doi.org/10.1016/s0026-2714(03)00035-0
https://doi.org/10.1016/s0026-2714(03)00035-0
Autor:
Seung Wook Yoon, Yonggang Jin, Xavier Baraton, Jerome Teysseyre, Pandi C. Marimuthu, Yaojian Lin
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
The shrinkage of the pitches and pads at the chip to package interface is happening much faster than the shrinkage at the package to board interface. This interconnection gap requires fan-out packaging, where the package size is larger than the chip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e42b01f265fa8533dd3e29b0b9abea6f
https://doi.org/10.1109/ectc.2012.6249017
https://doi.org/10.1109/ectc.2012.6249017
Autor:
Seung Wook Yoon, Pandi C. Marimuthu, Yonggang Jin, Jerome Teysseyrex, Yaojian Lin, Xavier Baraton
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
The shrinkage of the pitches and pads at the chip to package interface is happening much faster than the shrinkage at the package to board interface. This interconnection gap requires fan-out packaging, where the package size is larger than the chip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8960a6c76a5f258fef005caee22b8d5c
https://doi.org/10.1109/eptc.2011.6184517
https://doi.org/10.1109/eptc.2011.6184517
Autor:
Xavier Baraton, Pandi C. Marimuthu, Sharma Gaurav, Yonggang Jin, Yaojian Lin, V. P. Ganesh, Seung Wook Yoon, Thorsten Meyer, Andreas Bahr
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Integrated Circuits fabricated on silicon are assembled in different forms of electronic packages and are used extensively in electronic products such as personal, portable, healthcare, entertainment, industrial, automotive, environmental and securit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::977154ae36a3d25ae72d892878e700d2
https://doi.org/10.1109/ectc.2011.5898548
https://doi.org/10.1109/ectc.2011.5898548
Autor:
Yonggang Jin, Andreas Bahr, Xavier Baraton, Thorsten Meyer, Yaojian Lin, S. W. Yoon, Pandi C. Marimuthu, V. P. Ganesh
Publikováno v:
2010 12th Electronics Packaging Technology Conference.
Demand for wafer level packaging (WLP) is being driven by the need to shrink package size and height, simplify the supply chain and provide a lower overall cost by using the infrastructure of a batch process. “Fan-in” (FI)-WLP typically has a lim
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d931664240bc427cd33b3e8a52fed2d7
https://doi.org/10.1109/eptc.2010.5702695
https://doi.org/10.1109/eptc.2010.5702695
Autor:
Xavier Baraton
Publikováno v:
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).
Mobile electronics growth has recently been supported by the integration of more features for higher end devices. Smart phones are indeed growing at much faster pace than the overall mobile phone market. Requirements towards packaging are therefore a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::65c583eb2e80e83f9c07f28dbda13457
https://doi.org/10.1109/iemt.2010.5746764
https://doi.org/10.1109/iemt.2010.5746764
Publikováno v:
2009 11th Electronics Packaging Technology Conference.
After encapsulation, thermo-mechanical deformation builds up within the electronic packages due to temperature coefficient of expansion mismatch between the respective materials within the package as it cools to room temperature. The maximum Von Mise
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c4bbc5631abcc1e1a5be01160765cbc9
https://doi.org/10.1109/eptc.2009.5416480
https://doi.org/10.1109/eptc.2009.5416480
Publikováno v:
2009 11th Electronics Packaging Technology Conference.
Fan-out embedded wafer level ball grid array (eWLB) is a very promising packaging technology with many advantages in comparison to standard Ball Grid Array Packages and leadframe based packages because of smaller size, better electrical and thermal p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aaf50d4cbf4d19766363ed3341dc8456
https://doi.org/10.1109/eptc.2009.5416551
https://doi.org/10.1109/eptc.2009.5416551