Výsledky vyhledávání

[Distribution of the anterior corneal astigmatism in over 140 000 patients with age-related cataract]

Autor: H E, Li, Y, Wang, M S, Chen, X T, Li, Y X, Xu, Q Y, Tang, Y W, Zhou, Z M, Wu, J, Sima, L, Wu, Q S, Zeng, X R, Cao, Y, Gao, X H, Dang, Z F, Qiu, L, Li, Z Q, Li, M H, Shan, Liya, Zupi, H F, Xu, H X, Li

Publikováno v: [Zhonghua yan ke za zhi] Chinese journal of ophthalmology. 57(1)

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=pmid________::39e98ef381819162e0ff0a3a243d73c9
https://pubmed.ncbi.nlm.nih.gov/33412643

Zobrazit plný text záznamu

Warpage measurement of large area multitilted silicon substrates at various processing conditions

Autor: Anh X. H. Dang, Swapan K. Bhattacharya, I.C. Ume

Publikováno v: IEEE Transactions on Components and Packaging Technologies. 23:497-504

In order to find a low-cost solution for the future MCM-D packaging, a multitiling approach through the incorporation of several tiles on a large carrier substrate was studied. The multitiling format provides simultaneous processing of several small

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::d0b1c71871e158bbd3bae17f37779570
https://doi.org/10.1109/6144.868849

Zobrazit plný text záznamu

Process induced warpage in multitiled alumina substrates for large area MCM-D processing

Autor: Anh X. H. Dang, S.K. Bhattacharya, I.C. Ume

Publikováno v: IEEE Transactions on Advanced Packaging. 23:436-446

Electronics industries are responding to consumer demands in low-cost and high performance products for the 21st century, In order to find a low-cost solution for the future multichip module (MCM) packaging, a multitiling approach through the incorpo

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::52f4a27b7f8ad2ad54b780b2a557149f
https://doi.org/10.1109/6040.861558

Zobrazit plný text záznamu

A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging

Autor: I. Charles Ume, Swapan K. Bhattacharya, Anh X. H. Dang

Publikováno v: Journal of Electronic Packaging. 122:86-91

This paper presents potential application of stainless steel (SS) as a base substrate material for large area multi-chip module-deposited (MCM-D) packaging. Preliminary results on via formation on SS substrates by laser drilling, dielectric coating o

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::79f3aef971c61195997a4396a837b7ab
https://doi.org/10.1115/1.483152

Zobrazit plný text záznamu

Measurement of Dynamic Warpage During Thermal Cycling of Dielectric Coated SS Substrates for Large Area MCM-D Packaging

Autor: Anh X. H. Dang, Swapan K. Bhattacharya, I. Charles Ume

Publikováno v: Journal of Electronic Packaging. 122:77-85

Potential application of stainless steel (SS) as a base substrate material for a large area MCM-D packaging is reported in this paper. A test vehicle was fabricated using 0.008 in. thick and 12 in.×12 in. SS panel with laser drilled 0.01 in. vias. A

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::db279cabedd547e776a9504d22986925
https://doi.org/10.1115/1.483138

Zobrazit plný text záznamu

In-Situ Warpage Measurement During Thermal Cycling of Dielectric Coated SS Substrate for Large Area MCM-D Packaging

Autor: Anh X. H. Dang, I. Charles Ume, Swapan K. Bhattacharya

Publikováno v: Electronics Manufacturing Issues.

Feasibility of using stainless steel (SS) as a base substrate material for a large area MCM-D packaging is reported in this paper. A test vehicle was fabricated using 0.008 inch thick and 12-inch × 12-inch SS panel with laser drilled 0.01-inch vias.

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::669cbcb3f45c549314c4add6629d91e0
https://doi.org/10.1115/imece1999-0930

Zobrazit plný text záznamu

Vyhledávací nástroje:

Upřesnit hledání