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FabGPT: An Efficient Large Multimodal Model for Complex Wafer Defect Knowledge Queries

Autor: Jiang, Yuqi, Lu, Xudong, Jin, Qian, Sun, Qi, Wu, Hanming, Zhuo, Cheng

Intelligence is key to advancing integrated circuit (IC) fabrication. Recent breakthroughs in Large Multimodal Models (LMMs) have unlocked unparalleled abilities in understanding images and text, fostering intelligent fabrication. Leveraging the powe

Externí odkaz: http://arxiv.org/abs/2407.10810

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Hierarchical Decoupling Capacitor Optimization for Power Distribution Network of 2.5D ICs with Co-Analysis of Frequency and Time Domains Based on Deep Reinforcement Learning

Autor: Duan, Yuanyuan, Feng, Haiyang, Yu, Zhiping, Wu, Hanming, Shao, Leilai, Zhu, Xiaolei

With the growing need for higher memory bandwidth and computation density, 2.5D design, which involves integrating multiple chiplets onto an interposer, emerges as a promising solution. However, this integration introduces significant challenges due

Externí odkaz: http://arxiv.org/abs/2407.04737

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RLPlanner: Reinforcement Learning based Floorplanning for Chiplets with Fast Thermal Analysis

Autor: Duan, Yuanyuan, Liu, Xingchen, Yu, Zhiping, Wu, Hanming, Shao, Leilai, Zhu, Xiaolei

Chiplet-based systems have gained significant attention in recent years due to their low cost and competitive performance. As the complexity and compactness of a chiplet-based system increase, careful consideration must be given to microbump assignme

Externí odkaz: http://arxiv.org/abs/2312.16895

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