Zobrazeno 1 - 10
of 82
pro vyhledávání: '"Woonghwan Ryu"'
Autor:
Jun Ho Lee, Joungho Kim, Woonghwan Ryu, Seungyoung Ahn, Byung-Hun Kum, Chul-Oh Yoon, Junwoo Lee, Hyun Seok Choi, Jonghoon Kim
Publikováno v:
IEEE Transactions on Advanced Packaging. 26:90-98
The multiple line grid array (MLGA) interposer was recently introduced as a future high-density high-speed bonding method. In this paper, we introduce an electrical model and high-frequency characteristics of the MLGA interposer. The high-frequency e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::02b4f1bb633eba22c47c0e8394b9be9a
https://doi.org/10.1109/tadvp.2003.811554
https://doi.org/10.1109/tadvp.2003.811554
Autor:
Junwoo Lee, Jun Ho Lee, Jingook Kim, Joungho Kim, Woonghwan Ryu, Jae-Myun Kim, Namhoon Kim, Junso Pak
Publikováno v:
IEEE Transactions on Advanced Packaging. 25:356-364
In this paper, we introduce the microwave transmission characteristics of interconnection lines on a wafer level package (WLP) and also propose a precise microwave-frequency model of the WLP interconnections. The slow wave factor (SWF) and attenuatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7c3b49bcf7017ee8e0e82138d181a7be
https://doi.org/10.1109/tadvp.2002.805317
https://doi.org/10.1109/tadvp.2002.805317
Autor:
Sung Joo Park, Nitish Natu, Woonghwan Ryu, Sang Min Lee, Kee Sup Kim, Byung-Hyun Lee, Madhavan Swaminathan
Publikováno v:
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems.
Clock Distribution Networks (CDN) in three dimensional ICs face problems due to temperature and gradients observed across the die. The propagation delay of paths in the CDN varies and leads to mismatch in skew at the distribution points. This could p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::11168211fa531b63aac8c129e649a1c3
https://doi.org/10.1109/epeps.2014.7103613
https://doi.org/10.1109/epeps.2014.7103613
Autor:
Sung-Joo Kim, Chanmin Jo, Sang Min Lee, Jaemin Shin, Baekkyu Choi, Seongjae Moon, Woonghwan Ryu
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Recent fast-evolving mobile system demands high bandwidth and low power consumption, necessitating extension of LPDDR3 beyond 1.6 Gbps. This demand, however, brings significant technical challenges from the perspective of signal and power integrity.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5d60264c3abd75bbfc77b45fcb08e455
https://doi.org/10.1109/ectc.2014.6897588
https://doi.org/10.1109/ectc.2014.6897588
Autor:
Woonghwan Ryu, Max Sunghwan Min, Seung-Yong Cha, Eileen You, Se-ho You, GaWon Kim, Melinda Ling Yang, Seungbae Lee, Harpreet Gill, Young-Hoon Kim, Anil Gundurao
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
In this paper, a BGA package having a ARM SoC chip is introduced, which has component-type embedded decoupling capacitors (decaps) for good power integrity performance of core power. To evaluate and confirm the impact of embedded decap on core PDN (p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e021651d60cb688a06889a705f1edfe5
https://doi.org/10.1109/ectc.2014.6897311
https://doi.org/10.1109/ectc.2014.6897311
Autor:
Woonghwan Ryu, Myunghee Sung, Hyungsoo Kim, Joungho Kim, Namhoon Kim, Jeong-Gyun An, Seungyong Baek
Publikováno v:
IEEE Transactions on Advanced Packaging. 24:260-267
Crosstalk noise has become a significant problem in the design of high-speed digital interconnections. In this paper, we demonstrate a crosstalk reduction method, which has been successfully applied to the design of a CAT-5E modular jack. The CAT-5E
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::918c132d0b669dc5f913db1a2a0da63b
https://doi.org/10.1109/6040.938292
https://doi.org/10.1109/6040.938292
Autor:
Woopoung Kim, Seungyoung Ahn, Joungho Kim, Jun Ho Lee, Woonghwan Ryu, Kyung-Wook Paik, Myung-Jin Yim
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 23:542-545
This paper firstly reports on the high-frequency SPICE model of the ACF flip-chip interconnections up to 13 GHz. The extraction process is based on an optimization procedure, called a genetic algorithm, which is known as a robust optimization tool. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d0a0c3be9286ad46080ff17a5c0de1d
https://doi.org/10.1109/6144.868855
https://doi.org/10.1109/6144.868855
Autor:
Joungho Kim, Hyungsoo Kim, Seungyoung Ahn, Woonghwan Ryu, Baekkyu Choi, Namhoon Kim, Dong Gun Kam, Junwoo Lee
Publikováno v:
IEEE Transactions on Advanced Packaging. 23:398-407
With clock distribution of over 1 GHz, problems associated with clock skew, power consumption, and timing jitter are becoming critical for determining the processing speed of high-performance digital systems, especially for multi-processor systems. C
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::131c395aa5fa5f56b7742da28c51e77c
https://doi.org/10.1109/6040.861553
https://doi.org/10.1109/6040.861553
Publikováno v:
IEEE Transactions on Advanced Packaging. 23:495-503
Transmission line structures are needed for the high-performance interconnection lines of GHz integrated circuits (ICs) and multichip modules (MCMs), to minimize undesired electromagnetic wave phenomena and, therefore, to maximize the transmission ba
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0662860e93a17862ad4fb6c572b9ae2a
https://doi.org/10.1109/6040.861566
https://doi.org/10.1109/6040.861566
Publikováno v:
IEEE Transactions on Advanced Packaging. 23:148-155
A proposal is presented for an effective extraction method for crosstalk model parameters of high-speed interconnection lines. In the extraction procedure, mutual capacitance and mutual inductance of the coupled interconnection lines are extracted ba
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b449397316be7d35faa90c4435958f1
https://doi.org/10.1109/6040.846625
https://doi.org/10.1109/6040.846625