Zobrazeno 1 - 10
of 30
pro vyhledávání: '"Woong Ho Bang"'
Publikováno v:
JOM. 65:1362-1373
This article summarizes the mechanics of two mechanical fatigue methods, cyclic bending fatigue and shear fatigue, in inducing failure in solder joints in package assemblies, and it presents the characteristics of fatigue failures resulting from thes
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84391a2b2c7a2a7d9ef88a8b51a2265a
https://doi.org/10.1007/s11837-013-0720-2
https://doi.org/10.1007/s11837-013-0720-2
Autor:
N. L. Michael, Todd E. Ryan, Choong-Un Kim, Liang-Shan Chen, Young-Joon Park, Woong Ho Bang, Sean W. King
Publikováno v:
ECS Transactions. 35:757-771
This paper concerns the new method of detecting the integration failures in porous low-k (PLK)/Cu interconnects using simple voltammetry-based techniques. In essence, the technique takes advantage of the fact that pores in PLK allow permeation of liq
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e1001350a24f2471e882c44a03e68d5b
https://doi.org/10.1149/1.3572318
https://doi.org/10.1149/1.3572318
Publikováno v:
Journal of Electronic Materials. 38:1896-1905
This paper examines the mechanics of ball shear testing with the objective of understanding the mechanism by which the maximum shear force and the rate of crack growth is dependent on the solder bump size. For this, Pb-Sn solder bumps with diameters
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c9d690b7caa26c2741b2673fc227763
https://doi.org/10.1007/s11664-009-0842-z
https://doi.org/10.1007/s11664-009-0842-z
Publikováno v:
Materials Science Forum. :177-182
Bending fatigue behavior of eutectic Sn-3.5Ag solder bump bonded on FR4-PCB was characterized by experimental and finite element method (FEM). To investigate an effect of stress state on bump failure, which had not been weighed in conventional Coffin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba2f5146f40cc92a48364d0d55c22a2d
https://doi.org/10.4028/www.scientific.net/msf.580-582.177
https://doi.org/10.4028/www.scientific.net/msf.580-582.177
Publikováno v:
Journal of Electronic Materials. 37:417-428
This paper is concerned with the mechanics of interfacial fracture that are active in two common testing configurations of solder joint reliability. Utilizing eutectic Pb-Sn/Cu as a reference system and assuming the presence of a predefined crack siz
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::358d6b325c000750c6291fd41aae3cd1
https://doi.org/10.1007/s11664-008-0393-8
https://doi.org/10.1007/s11664-008-0393-8
Publikováno v:
Journal of Electronic Materials. 34:1287-1300
This paper surveys and compares creep and stress relaxation data on finegrained eutectic Sn-Pb. It examines the consistency of the available data on this extensively studied solder material and studies whether stress relaxation offers a reasonable al
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a09b8f2f92ba069da64d6f4575da7b10
https://doi.org/10.1007/s11664-005-0252-9
https://doi.org/10.1007/s11664-005-0252-9
Autor:
Sung-Joon Kim, Chang Gil Lee, Jae-Hyung Cho, Woong Ho Bang, Kyu Hwan Oh, Suk Hoon Kang, Heung Nam Han
Publikováno v:
Materials Science Forum. :901-906
Microstructural characteristics of friction-stir-welded Al 6061-T651 with varying rotating and advancing speed were examined by the electron backscattering diffraction (EBSD) installed in field emission-scanning electron microscopy (FE-SEM). It was f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::73690baf8b2b26db598c4ad5924dcc1b
https://doi.org/10.4028/www.scientific.net/msf.495-497.901
https://doi.org/10.4028/www.scientific.net/msf.495-497.901
Autor:
Suk Hoon Kang, Sang Hoon Park, Jae-Hyung Cho, Hee Suk Jung, Yong-Jin Park, Woong Ho Bang, Kyu Hwan Oh, Dong Sup Kim, Jong Soo Cho
Publikováno v:
Materials Science Forum. :907-912
This paper studies the microstructure of drawn gold wires to equivalent strain of 10 and to equivalent strain of 8.5 then heat-treated. The texture of gold wire drawn to strain of 10 is mainly composed of and fibers. Tensile strength of the gold wire
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::127513a2b68d7f22168ab50dc3c1eb56
https://doi.org/10.4028/www.scientific.net/msf.495-497.907
https://doi.org/10.4028/www.scientific.net/msf.495-497.907
Publikováno v:
Materials Science Forum. :4223-4226
Under a high-pressure condition, the wear characteristics of alloyed and unalloyed ductile cast iron were investigated. Mn, Cu, Si and Mo were chosen as alloying elements, and their effects on mechanical properties of hardness and toughness were corr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::706a8bf81a5f722c6581b414e6547b7e
https://doi.org/10.4028/www.scientific.net/msf.475-479.4223
https://doi.org/10.4028/www.scientific.net/msf.475-479.4223
Publikováno v:
Materials Science Forum. :3223-3226
A computational model for roll pressing of powder was developed based on an elastoplastic finite element method, and was applied to predict the alligatoring behavior at roll nip during powder compacting process. The yield criterion for powder has bee
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d821918884a547a3cd5e986ebc0b6981
https://doi.org/10.4028/www.scientific.net/msf.475-479.3223
https://doi.org/10.4028/www.scientific.net/msf.475-479.3223