Zobrazeno 1 - 10
of 51
pro vyhledávání: '"Woon Young Lee"'
Autor:
Woon Young Lee
Publikováno v:
JOURNAL OF THE KOREAN SOCIETY DESIGN CULTURE. 28:355-369
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3bda902e169d301054807630e4a12961
https://doi.org/10.18208/ksdc.2022.28.3.355
https://doi.org/10.18208/ksdc.2022.28.3.355
Publikováno v:
Electronic Materials Letters. 18:583-591
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2179f51bc25f438adc54509431c26769
https://doi.org/10.1007/s13391-022-00364-6
https://doi.org/10.1007/s13391-022-00364-6
Autor:
Ok Mi Pak, Woon Young Lee
Publikováno v:
JOURNAL OF THE KOREAN SOCIETY DESIGN CULTURE. 28:149-160
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ff991c3202a3b5910e7994a998cc756
https://doi.org/10.18208/ksdc.2022.28.1.149
https://doi.org/10.18208/ksdc.2022.28.1.149
Autor:
Woon-Young Lee
Publikováno v:
Korean Literature Education Research. 74:103-134
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da55aeb649421cd57e09351f0156392a
https://doi.org/10.37192/kler.74.4
https://doi.org/10.37192/kler.74.4
Publikováno v:
ACS omega. 7(41)
Highly uniform Cu micropillars were electrodeposited on a Cu seed layer in a micropatterned photoresist in the presence of binary levelers containing pyrrolidine and pyridine functional groups. The adsorption behaviors of binary levelers, i.e., 3-hyd
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7d54b586f76e0ecb40a6c712332e414f
https://pubmed.ncbi.nlm.nih.gov/36278072
https://pubmed.ncbi.nlm.nih.gov/36278072
Publikováno v:
Korean Logistics Research Association. 31:37-47
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3548eaed54ac06a6f5aeb57bfaf4da04
https://doi.org/10.17825/klr.2021.31.2.37
https://doi.org/10.17825/klr.2021.31.2.37
Autor:
Woon Young Lee
Publikováno v:
JOURNAL OF THE KOREAN SOCIETY DESIGN CULTURE. 26:429-446
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e1b31e98d07ea66e1bb788050fa7678
https://doi.org/10.18208/ksdc.2020.26.2.429
https://doi.org/10.18208/ksdc.2020.26.2.429
Publikováno v:
Electronic Materials Letters. 19:119-119
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::047a01b3038ef1fa9a589a96c4a2f626
https://doi.org/10.1007/s13391-022-00383-3
https://doi.org/10.1007/s13391-022-00383-3
Autor:
Woon Young Lee, Ok Mi Pak
Publikováno v:
JOURNAL OF THE KOREAN SOCIETY DESIGN CULTURE. 25:223-239
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b3388e8685434ce06ffc388e21cb2a39
https://doi.org/10.18208/ksdc.2019.25.4.223
https://doi.org/10.18208/ksdc.2019.25.4.223