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pro vyhledávání: '"Woon Kab Jung"'
Publikováno v:
2008 58th Electronic Components and Technology Conference.
The molded underfill (MUF) process has a lot of advantages compared with capillary underfill process in view of reduction of process, cycle time of process, material and equipment cost since this application utilizes the conventional mold materials a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c4e9c6a306675c53e7a0831e9de36894
https://doi.org/10.1109/ectc.2008.4550000
https://doi.org/10.1109/ectc.2008.4550000
Publikováno v:
2008 58th Electronic Components & Technology Conference; 2008, p382-388, 7p