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Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Since the first Fan-out Wafer Level Packaging (FOWLP) was introduced in 2001 by Infineon, lots of technical advancements and studies related to this technology have been reported, but thermal studies have not been reported due to their thermal favora
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6961df74ad64b4f268a4b184ebdd5502
https://doi.org/10.1109/ectc32862.2020.00313
https://doi.org/10.1109/ectc32862.2020.00313
