Zobrazeno 1 - 10
of 36
pro vyhledávání: '"Woojin Jang"'
Publikováno v:
Sensors, Vol 21, Iss 23, p 8153 (2021)
Based on the results of computational fluid dynamics simulations, this study designed and fabricated a flexible thermal-type micro flow sensor comprising one microheater and two thermistors using a micro-electromechanical system (MEMS) process on a f
Externí odkaz:
https://doaj.org/article/c13a021fd1774dfbb151937c28d2c461
Publikováno v:
Applied Sciences, Vol 11, Iss 9, p 4035 (2021)
In the case of light-emitting diode (LED) seaport luminaires, they should be designed in consideration of glare, average illuminance, and overall uniformity. Although it is possible to implement light distribution through auxiliary devices such as re
Externí odkaz:
https://doaj.org/article/d8f7197c370d47ee842f111c98bea4d7
Long-Term Reliability Characteristics of OLED Panel and Luminaires for General Lighting Applications
Publikováno v:
Applied Sciences, Vol 11, Iss 1, p 74 (2020)
Organic light-emitting diode is one of the future-proof solid-state-based lighting sources. OLED shows great aesthetic advantages and good color quality without glare. Moreover OLED is a kind of surface light sources naturally. There are some studies
Externí odkaz:
https://doaj.org/article/eb379a84c1c84029aabe9d2e97743dc1
Autor:
Woojin Jang, Christine Myunghee Ahn
Publikováno v:
KOREAN JOURNAL OF YOUTH STUDIES. 30:59-87
Autor:
Woojin Jang, Sanggyun Na
Publikováno v:
The Journal of Humanities and Social sciences 21. 14:1129-1144
Autor:
Woojin Jang, Soojeong Lee
Publikováno v:
Korean Association For Learner-Centered Curriculum And Instruction. 22:327-341
Publikováno v:
Food Science and Biotechnology.
Publikováno v:
ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC).
Autor:
Konstantinos Georgiou, Woojin Jang
Publikováno v:
Algorithmics of Wireless Networks ISBN: 9783031220494
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a8103a5ede08f328e6433a5ae473dfb
https://doi.org/10.1007/978-3-031-22050-0_6
https://doi.org/10.1007/978-3-031-22050-0_6
Autor:
Jong-Mil Youn, Kichang Sung, Ju-Heon Kim, Jeong-Hoon Ahn, Wonkyu Han, Junki Jang, Yun-Ki Choi, Woojin Jang, Hoon Kim, Chang-Hyun Kim, Hyunju Yim, Wonmo Kang, Rak-Hwan Kim, Youngju Lim, Young Soo Yoon, Dongwoo Shin
Publikováno v:
2021 IEEE International Interconnect Technology Conference (IITC).
We demonstrate that when a thin ALD (atomic layer deposition) TaN as a barrier metal is deposited to the Cu interconnect, the upper via resistance is significantly increased. We also exhibit that the abnormal upper via resistance is consistent with t