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Publikováno v:
International Symposium on Microelectronics. 2017:000584-000589
Semiconductor manufacturers are continuously driving efforts to put more computing power and speed into less volume. At the same time, consumers are demanding devices with more functionality that integrate a variety of interconnected circuit types. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b3a7c732c88edab2c4ea784a9384532
https://doi.org/10.4071/isom-2017-tha36_058
https://doi.org/10.4071/isom-2017-tha36_058
Publikováno v:
2019 International Wafer Level Packaging Conference (IWLPC).
Semiconductor manufacturers are continuously driving efforts to put more computing power and speed into less volume. At the same time, consumers are demanding devices with more functionality that integrate a variety of interconnected circuit types. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4e1c3d85fc3322d2c7b8efc82a7929d
https://doi.org/10.23919/iwlpc.2019.8914148
https://doi.org/10.23919/iwlpc.2019.8914148
Publikováno v:
International Symposium on Microelectronics. 2016:000540-000544
The semiconductor industry continues to drive down defectivity rates, especially as the liability to ship replacement parts for field failures is pushed back into the supply chain. As dimensions are driven down to finer pitch, there are a certain cla
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::043911a0961da219332c779b2909e60b
https://doi.org/10.4071/isom-2016-poster8
https://doi.org/10.4071/isom-2016-poster8
Publikováno v:
2018 International Wafer Level Packaging Conference (IWLPC).
Die sizes continue to shrink and packaging technologies continue to evolve, but the common thread for all of them is the need for increased precision and tighter process control limits to achieve final package yield. Nearly all packaging technologies
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8d16b0807ed5cb5a66ba62c0b65d5535
https://doi.org/10.23919/iwlpc.2018.8573292
https://doi.org/10.23919/iwlpc.2018.8573292
Publikováno v:
SMC
This paper proposes a motion planning method for an autonomous vehicle in an urban environment. The proposed method generates trajectories using the closed-loop forward simulation (CLFS), which can consider various properties of an autonomous vehicle
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::89fec64be7b4171bced2bab89b760dd1
https://doi.org/10.1109/smc.2016.7844532
https://doi.org/10.1109/smc.2016.7844532
Publikováno v:
SPIE Proceedings.
The rotor position and speed estimation of permanent-magnet synchronous motor(PMSM) was dealt with. By measuring the phase voltages and currents of the PMSM drive, two diagonally recurrent neural network(DRNN) based observers, a neural current observ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a70932ada2d28b17bd061a3c0d1edad
https://doi.org/10.1117/12.664658
https://doi.org/10.1117/12.664658