Zobrazeno 1 - 10 of 23 pro vyhledávání: '"Woo Yong Jeon"'
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Akademický článek
Improvement of osseointegration of Ti–6Al–4V ELI alloy orthodontic mini-screws through anodization, cyclic pre-calcification, and heat treatments
Autor: Changkyun Im, Je-Hyeok Park, Young-Mi Jeon, Jong-Ghee Kim, Yong-Seok Jang, Min-Ho Lee, Woo-Yong Jeon, Jun-Min Kim, Tae-Sung Bae
Publikováno v: Progress in Orthodontics, Vol 23, Iss 1, Pp 1-10 (2022)
Abstract Background Mini-screws are widely used as temporary anchorages in orthodontic treatment, but have the disadvantage of showing a high failure rate of about 10%. Therefore, orthodontic mini-screws should have high biocompatibility and retentio
Externí odkaz: https://doaj.org/article/9a48620e4c7245dab8337a21f3e64b7e
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Improvement of osseointegration of Ti-6Al-4V ELI alloy orthodontic mini-screws through anodization, cyclic pre-calcification, and heat treatments
Autor: Changkyun Im, Je-Hyeok Park, Young-Mi Jeon, Jong-Ghee Kim, Yong-Seok Jang, Min-Ho Lee, Woo-Yong Jeon, Jun-Min Kim, Tae-Sung Bae
Publikováno v: Progress in orthodontics. 23(1)
Background Mini-screws are widely used as temporary anchorages in orthodontic treatment, but have the disadvantage of showing a high failure rate of about 10%. Therefore, orthodontic mini-screws should have high biocompatibility and retention. Previo
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ba59c681db05dd729fa3509499b8f06f
https://pubmed.ncbi.nlm.nih.gov/35368222
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9
Effects of plasma treatment on the peel strength of Ni on polyimide
Autor: Kwang-Hee Jung, Il-Song Park, Kyeong-Won Seol, Tae-Gyu Woo, Woo-Yong Jeon, Young-Kyu Hwang
Publikováno v: Electronic Materials Letters. 8:151-156
In microelectronics packaging, the reliability of the metal/polymer interface is an important issue because the adhesion strength between dissimilar materials is often inherently poor. This paper reports the peel strength and surface morphology of a
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::fc7cfe4b352068d4eee9b1f7d88fe860
https://doi.org/10.1007/s13391-012-1075-5
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10
Effect of RF sputtering power on the adhesion of Ni thin film to polyimide
Autor: Kwang-Hee Jung, Tae-Gyu Woo, Woo-Yong Jeon, Il-Song Park, Kyeong-Won Seol
Publikováno v: Electronic Materials Letters. 7:353-358
This study represents the results of an investigation of the peel strength and surface morphology according to the Ni sputtering power in producing Cu/Ni/PI structured flexible copper clad laminate (FCCL) using polyimide (PI). In order to analyze the
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::cee0ec36a7b651b752cac94f189d637d
https://doi.org/10.1007/s13391-011-0270-0
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