Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Wonil Seo"'
Autor:
Seong-Hyun Park, Won-Je Kim, Hui Li, Wonil Seo, Sang-Hyun Park, Hwan Kim, Sang Chul Shin, Erik R. P. Zuiderweg, Eunice EunKyeong Kim, Taebo Sim, Nak-Kyoon Kim, Injae Shin
Publikováno v:
Scientific Reports, Vol 7, Iss 1, Pp 1-11 (2017)
Abstract In this study we examined the anti-leukemia activity of a small molecule inhibitor of Hsp70 proteins, apoptozole (Az), and hybrids in which it is linked to an inhibitor of either Hsp90 (geldanamycin) or Abl kinase (imatinib). The results of
Externí odkaz:
https://doaj.org/article/c293a04a3a7f4e7ea36a495332a1bd11
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:1042-1051
A growth of intermetallic compounds (IMCs) at the interface between electroless Ni/immersion Au (ENIG) and Sn-3.0Ag-0.5Cu (SAC305) solder and related brittle fracture behavior of solder joint with microstructure changes of electroless Ni-P was invest
Publikováno v:
Journal of Materials Science: Materials in Electronics. 30:15889-15896
The void fraction in the solder joint of a chip resistor and its effect on the solder joint strength and reliability were investigated. The solder joint of a chip resistor has two regions: solder beneath the component and solder fillet. Although the
Publikováno v:
Journal of Materials Science: Materials in Electronics. 30:7645-7653
The electromigration reliability and failure modes of Sn–3.0Ag–0.5Cu (SAC)/Cu–Zn solder joints were investigated at 146 °C and a current density of 1.1 × 104 A/cm2. After aging at 146 °C for 150 h without electric current, typical bi-layers
Publikováno v:
Journal of Alloys and Compounds. 724:492-500
The effect of Cu electroplating parameters, i.e., the bath composition and current density, on the impact strength of Sn-3.0Ag-0.5Cu (SAC)/Cu joints was investigated using a high-speed ball shear test. An SAC solder ball was attached to an electropla
Publikováno v:
Journal of Electronic Materials. 47:110-116
The growth of interfacial intermetallic compound and the brittle fracture behavior of Sn-3.0Ag-0.5-Cu solder (SAC305) joints on electroless nickel immersion gold (ENIG) surface finish have been investigated using Ni-P plating solution at temperatures
Publikováno v:
Journal of Welding and Joining. 35:1-6
Autor:
Wonil Seo, Sanghyun Park, Eunice Eun Kyeong Kim, Erik R. P. Zuiderweg, Hwan Kim, Nak Kyoon Kim, Seong Hyun Park, Injae Shin, Won Je Kim, Taebo Sim, Hui Li, Sang Chul Shin
Publikováno v:
Scientific Reports, Vol 7, Iss 1, Pp 1-11 (2017)
SCIENTIFIC REPORTS(7)
Scientific Reports
SCIENTIFIC REPORTS(7)
Scientific Reports
In this study we examined the anti-leukemia activity of a small molecule inhibitor of Hsp70 proteins, apoptozole (Az), and hybrids in which it is linked to an inhibitor of either Hsp90 (geldanamycin) or Abl kinase (imatinib). The results of NMR studi
Publikováno v:
Journal of Electronic Materials. 43:4457-4463
The effect of bath life of Ni(P) on the brittle-fracture behavior of Sn-3.0 wt.%Ag-0.5 wt.%Cu (SAC)/electroless nickel immersion gold (ENIG) was evaluated in this study. The bath lives of Ni(P) for the ENIG surface finish in this study were varied fr
Publikováno v:
Advanced Science and Technology Letters.
Glass walls for exterior building can help save energy as increase inflow of natural sunlight. However, when sunlight directly reaches on floor, it can be occurred reflection glare, and visual discomfort. A blind can be in charge of preventing glare,