Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Wongeol Lee"'
Autor:
InSu Mok, Curtis Zwenger, Moh Kolbehdari, IlBok Lee, Alex Copia, WonChul Do, Kang-Wook Lee, Wongeol Lee, Suresh Jayaraman, WonMyoung Ki
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Fan-out wafer level packaging (FOWLP) is one of the latest technologies to meet the requirements of high performance and thin form-factor, especially for mobile application processors. To achieve a simple path way and thinner package form, many outso
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ba204afcca55ef029be9dab43a68c11
https://doi.org/10.1109/ectc.2018.00092
https://doi.org/10.1109/ectc.2018.00092
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:000217-000247
The tremendous growth in the mobile handset, tablet, and networking markets has been fueled by consumer demand for increased mobility, functionality, and ease of use. This, in turn, has been driving an increase in functional convergence and 3D integr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::362cfcf292f221e106d76bcaa73e160e
https://doi.org/10.4071/2015dpc-ta22
https://doi.org/10.4071/2015dpc-ta22
Autor:
Curtis Zwenger, JiHun Yi, WonChul Do, Bora Baloglu, Michael G. Kelly, Wongeol Lee, George J. Scott
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
The tremendous growth in smartphones and tablets has been fueled by consumer demand for increased mobility, functionality, and ease of use. This, in turn, has been driving an increase in functional convergence and 3D integration of integrated circuit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3fe9982e99c8689cf4ae2362091a2f6
https://doi.org/10.1109/ectc.2017.321
https://doi.org/10.1109/ectc.2017.321
Autor:
Zwenger, Curtis, Scott, George, Baloglu, Bora, Jayaraman, Suresh, WonChul Do, WonGeol Lee, JiHun Yi
Publikováno v:
Advancing Microelectronics; Jan/Feb2018, Vol. 45 Issue 1, p6-9, 4p