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pro vyhledávání: '"Wong Joon Hwang"'
Autor:
Wong Joon Hwang, Hyung Kun Kim, Moo Whan Shin, Yong Jo Park, Tae Hee Lee, Jong Hwa Choi, Okhyun Nam
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 30:637-642
We investigated thermal behavior of GaN-based laser diode (LD) packages as a function of cooling systems, die attaching materials, chip loading conditions, and optical performances. The electrical thermal transient technique was employed for the ther
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e9b22fe37c3759a90720b14dde3bb15
https://doi.org/10.1109/tcapt.2007.906346
https://doi.org/10.1109/tcapt.2007.906346
