Výsledky vyhledávání - "Wong, Brian Stephen."

Nondestructive evaluation interfaces defects IC packaging

Autor: Guo, Ningqun., Ling, Shih Fu., Wong, Brian Stephen.

There are many interfaces in IC packaging, such as that between mold compound and silicon chip, and that between silicon die, die attach and copper lead-frame. The quality of these interfaces has been a critical issue in the reliability testing of IC

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od______1392::ef5435b82a3ab6ffabf7bc1aa0113e27
http://hdl.handle.net/10356/6966

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Development of thermographic non-destructive testing of materials

Autor: Bai, Weimin, Tui, Chen Guan, Wong, Brian Stephen

This project was carried out to examine the application of lock-in thermography in NDT. RG 69/96

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od______1392::13c21efae652e8fdb56b8e0550ca6c8e
http://hdl.handle.net/10356/6959

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Akademický článek

Measurement and characterization of porosity in aluminium selective laser melting parts using X-ray CT.

Autor: Cai, Xingfang, Malcolm, Andrew Alexander, Wong, Brian Stephen, Fan, Zheng

Publikováno v: Virtual & Physical Prototyping; Dec2015, Vol. 10 Issue 4, p195-206, 12p

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Expert systems for non-destructive testing applications

Autor: Wong, Brian Stephen., Teoh, Lean Lee., Liang, Meng Heng., Wong, Eddie.

80 p. Software has been developed to analyse the signals from the eddy-current inspection of heat exchanger tubes. The software logic follows the procedure adopted by human operators in the analysis of the eddy signals. In almost all cases, defects c

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od______1392::7d52c8c518fd608bb8974712c2421f3e
http://hdl.handle.net/10356/46623

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