Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Won-chul Moon"'
Publikováno v:
Materials Science and Engineering: A. :723-726
An oxidation treatment was conducted in a rolled copper foil of 9 μm in the thickness by a method of the electroless plating in the alkali liquid having sodium as the main element. The morphology of the oxidized surface was varied from patch type to
Autor:
Hyoungsub Kim, Jae-Hong Lee, Chang-Yong Lee, Don-Hyun Choi, Won-Chul Moon, Hoo-Jeong Lee, Seung-Boo Jung
Publikováno v:
Microelectronic Engineering. 84:2653-2657
Rolled copper foil of 18@mm thickness underwent nodule treatment via electro plating in a solution containing dissolved CuSO"4 and NiSO"4. The product formed on the surface of the copper foil varied from copper oxides to nickel compounds of the spher
Autor:
Jeong-Won Yoon, Jong-Woong Kim, Won-Chul Moon, Seung-Boo Jung, Bo-In Noh, Ja-Myeong Koo, Sang-Su Ha, Jeong-Hoon Moon
Publikováno v:
Journal of the Korean Welding and Joining Society. 25:6-15
Effect of plasma treatment on adhesion characteristics at interfaces between underfill and substrate
Publikováno v:
International Journal of Adhesion and Adhesives. 27:200-206
The effects of plasma treatment on the surfaces of the flame resistant-4 (FR-4) and copper substrates are investigated in terms of X-ray photoelectron spectroscopy (XPS), contact angle, and atomic force microscopy (AFM). The adhesion strengths of the
Publikováno v:
Journal of Materials Research. 21:3196-3204
Joint reliability of immersion Ag with two different solders, Sn–37Pb and Sn–3.5Ag, were evaluated. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction
Publikováno v:
Microelectronic Engineering. 83:2391-2395
The flip chip solder bump was investigated in situ with current stressing in an ambient temperature of 423K. For the in situ investigation of the solder joints, a single flip chip package was examined during whole investigation time. Cross-sectional
Publikováno v:
Microelectronic Engineering. 83:2329-2334
The interfacial reaction of the ENIG/Sn-3.5Ag-0.7Cu/ENIG sandwich solder joint was studied during aging at 150^oC for up to 1000h. (Ni,Cu)"3Sn"4 intermetallic compounds (IMCs) formed at both ENIG/Sn-Ag-Cu/ENIG interfaces after reflowing. After aging
Publikováno v:
Microelectronic Engineering. 83:2335-2340
Effects of reflow process on the thermo-mechanical reliability of the anisotropic conductive film (ACF) joints were investigated. Cross-sectional studies were carried out to investigate the effects using a scanning electron microscope (SEM). Swelling
Publikováno v:
SHINKU. 46:429-432
Cone-type carbon nanostructures (referred to as “nanotip”, hereafter) have been synthesized on a highly ordered pyrolytic graphite (HOPG) substrate by microwave plasma-enhanced chemical vapor deposition using methane (CH4) and/or hydrogen (H2) ga
Publikováno v:
Ultramicroscopy. 86:49-53
Atomic force microscopy (AFM) has been used for tribological studies of Si surfaces covered by oxide layers of various kinds: chemical oxides prepared by the SC1 (NH4OH/H2O2/H2O) and the SC2 (HCl/H2O2/H2O) treatments and a thermal oxide. In the case