Výsledky vyhledávání - "Won Sik Hong"

Akademický článek

The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders

Autor: Yujin Park, Jung-Hwan Bang, Chul Min Oh, Won Sik Hong, Namhyun Kang

Publikováno v: Metals, Vol 7, Iss 12, p 540 (2017)

Solder joints are the main weak points of power modules used in harsh environments. For the power module of electric vehicles, the maximum operating temperature of a chip can reach 175 °C under driving conditions. Therefore, it is necessary to study

Externí odkaz: https://doaj.org/article/fed9e6ef794e4f3cb8c261a733d3b05c

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In-situ Observation and Modeling of Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with OSP and ENEPIG Surface Finish

Autor: Jieun Yu, Myeonghwan Choi, Dong-Yurl Yu, Won Sik Hong, Cheolho Park, Namhyun Kang

Publikováno v: Electronic Materials Letters. 19:229-238

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::543f3520baaaffcc78cc4d2f31e40583
https://doi.org/10.1007/s13391-022-00405-0

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Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints

Autor: Mi-Song Kim, Won Sik Hong, Hye-Min Lee, Myeongin Kim

Publikováno v: Journal of Welding and Joining. 40:207-214

In this study, the degradation characteristics of solder joints composed of powder-size Sn-3.0Ag-0.5Cu and the substrate surface finish are compared. Reflow is performed at a N2 ambient to apply an organic solderability preservative (OSP), electroles

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::32d3a60f6a471a425b74041e5dde2040
https://doi.org/10.5781/jwj.2022.40.3.1

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Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test

Autor: Myeongin Kim, Won Sik Hong, Mi-Song Kim

Publikováno v: Journal of Welding and Joining. 40:271-277

In this study, the laser soldering process of probe-multilayer ceramic (MLC) substrates was optimized using Type 4 (T4) and Type 7 (T7) Sn-3.0Ag-0.5Cu (SAC305), T7 Sn-0.7Cu solders to improve the high-temperature durability of probe solder joints and

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4d4b8edf289c6723d403122b11228d8c
https://doi.org/10.5781/jwj.2022.40.3.9

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Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with ENEPIG Surface Finish

Autor: Jieun Yu, Sujong Kim, Won Sik Hong, Namhyun Kang

Publikováno v: Journal of Welding and Joining. 40:225-232

The equation for predicting the growth behavior of intermetallic compounds (IMC) by electromigration (EM) of the Cu/ENEPIG/Sn-2.5Ag/Cu solder joint was modeled, and the actual behavior observed through experiments and the predicted behavior were comp

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::4ff840a67512b41f09eba246fe8462e6
https://doi.org/10.5781/jwj.2022.40.3.3

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Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste

Autor: Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong

Publikováno v: Journal of Welding and Joining. 40:165-174

To confirm the possibility of simultaneous bonding between Si chip and multilayer ceramic capacitors (MLCCs), vacuum reflow soldering is performed between a Si chip and each of 2012, 1608, 1005, 0603, and 0402 MLCCs using Type-7 Sn-3.0Ag-0.5Cu (SAC30

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::6a989a7f4e9f49d165a4b3cdff430e01
https://doi.org/10.5781/jwj.2022.40.2.8

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A Study on the Frame and Attribution of Media Reports on Disease Disaster : Focusing on Covid-19 ‘Daegu Shincheonji’ Reports

Autor: Chang Suk Kim, Won-Sik Hong

Publikováno v: Korean Journal of Social Science. 40:245-286

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::9842bdd3787f17c9560fdaa1df9900bd
https://doi.org/10.18284/jss.2021.12.40.3.245

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Microstructural Evolution of Cantilever Wire Probe after Touch-Down Fatigue Cycles for Power Semi-Conductor Wafer Testing

Autor: Won Sik Hong, Mi-Song Kim, Myeongin Kim

Publikováno v: Journal of Welding and Joining. 39:677-683

As fatigue fracture occurs in the bending area of the wire probe of the probe card owing to fatigue load during the touch-down (T/D) test, the development of wire probe materials with improved fatigue properties according to the wire materials is req

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::5e61002c83697bbb0ff61c96be7ae3ba
https://doi.org/10.5781/jwj.2021.39.6.13

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Design and Experimental Evaluation of Transfer-Molded 650 V Super-Junction mosfet Power Module for Industrial Applications

Autor: Sang Won Yoon, Jaejin Jeon, Hun-Chang Im, Won Sik Hong, You Suk Kim, Jihwan Seong, Jangmuk Lim

Publikováno v: IEEE Transactions on Industry Applications. 57:6295-6305

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::24fab048bc25b27048828188cd2bd51c
https://doi.org/10.1109/tia.2021.3113624

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Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing

Autor: Won Sik Hong, Myeongin Kim, Yunhwi Park, Mi-Song Kim, Sang-Hyuk Yun

Publikováno v: Journal of Welding and Joining. 39:368-375

In this study, the laser soldering process of microelectromechanical system (MEMS) probes and multilayer ceramic (MLC) substrates was optimized with Type 4 (T4) and Type 7 (T7) Sn-3.0Ag-0.5Cu (SAC305), Type 4 Sn-0.3Ag-0.7Cu (SAC0307), and Type 4 Sn-5

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::819d1b85c227272dc23836c1ba042075
https://doi.org/10.5781/jwj.2021.39.4.4

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