Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Won Kyung Choi"'
Publikováno v:
International Symposium on Microelectronics. 2018:000252-000258
This paper is a follow on to the paper presented at the IMAPS 14th International Conference DEVICE PACKAGING and will provide more comprehensive case studies of few different system integration strategies for high frequency packaging. The packaging o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::516de050c3a8527d6dfe2717a26c3187
https://doi.org/10.4071/2380-4505-2018.1.000252
https://doi.org/10.4071/2380-4505-2018.1.000252
Autor:
Kang Hai Lee, Kang Chen, Seung Wook Yoon, Yeow Kheng Lim, Chi Yen-Yao, Seng Guan Chow, Benson Lin, Won Kyung Choi, Liu Nai-Wei
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
The number of WLP (Wafer Level Packages) used in semiconductor packaging has experienced significant growth since its introduction due to the small form factor and high performance requirements. With the advancement of fan-out wafer level packaging t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a82aca3d89674012762a31c84f22429e
https://doi.org/10.1109/ectc.2019.00180
https://doi.org/10.1109/ectc.2019.00180
Autor:
Francis Chee Peng Lim, Won Kyung Choi, Yew Kheng Lim, Aung Kyaw Oo, Mats Carlsson, Dapeng Wu, Erik Öjefors, Seung Wook Yoon, Robin Dahlbäck
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
The continued growth in mobile data traffic is pushing for new and innovative solutions. Over the next few years, cellular phones, tablets, and computers will switch to 5G wireless technology. In this work, an highly integrated WiGig/802.11ad complia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c70140ed9feb7d0eb1314806ac025e51
https://doi.org/10.1109/ectc.2019.00151
https://doi.org/10.1109/ectc.2019.00151
Publikováno v:
International Symposium on Microelectronics. 2016:S1-S22
To meet the continued demand for form factor reduction and functional integration of electronic devices, WLP (Wafer Level Packaging) is an attractive packaging solution with many advantages in comparison with standard BGA (Ball Grid Array) packages.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b48a82c49bdb0174f99282466e38d3c2
https://doi.org/10.4071/isom-2016-slide-9
https://doi.org/10.4071/isom-2016-slide-9
Autor:
Bernard Adams, Riko Radojcic, Seung Wook Yoon, Andy Yong, Duk Ju Na, Won Kyung Choi, Urmi Ray, Jae Sik Lee
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:000809-000825
The market for portable and mobile data access devices connected to a virtual cloud access point is exploding and driving increased functional convergence as well as increased packaging complexity and sophistication. This is creating unprecedented de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ec22981d95111231606ba01bcdeff2e3
https://doi.org/10.4071/2016dpc-tp24
https://doi.org/10.4071/2016dpc-tp24
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
To meet the continued demand for form factor reduction and functional integration of electronic devices, Wafer Level Packaging (WLP) is an attractive packaging solution with many advantages in comparison with standard Ball Grid Array (BGA) packages.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63aa8ccbc8fce60015ded38bee9b6e4d
https://doi.org/10.1109/ectc.2017.237
https://doi.org/10.1109/ectc.2017.237
Publikováno v:
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
The trends for smartphone and other mobile devices are more than ever for integration and lower cost. Meanwhile, a higher degree of functionality and performance, thinner profile, and longer battery life are some of the additional market drivers seen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b58d4a4d8dfe6565213f033c450d5e40
https://doi.org/10.1109/icept.2016.7583199
https://doi.org/10.1109/icept.2016.7583199
Publikováno v:
Journal of the Korean Society for Clothing Industry. 12:574-581
Trunks like men`s underpants are similar to boxer shorts and are made in both modern and traditional styles. Like boxer shorts, trunks cover the mid-section of the body (hence the name "trunk"). As the income level of the nation increases, men as wel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f3cf5202e14a3f80f1a5982efc8cd9d
https://doi.org/10.5805/ksci.2010.12.5.574
https://doi.org/10.5805/ksci.2010.12.5.574
Publikováno v:
The KIPS Transactions:PartA. :205-214
Flash memory is at high speed used as storage of personal information utilities, ubiquitous computing environments, mobile phones, electronic goods, etc. This is because flash memory has the characteristics of low electronic power, non-volatile stora
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4ac2a9bb8aa00229717869e20658581
https://doi.org/10.3745/kipsta.2005.12a.3.205
https://doi.org/10.3745/kipsta.2005.12a.3.205
Autor:
Kyaw Oo Aung, Seung Wook Yoon, Won Kyung Choi, Tsuyoshi Kida, Michitaka Kimura, Tomoaki Hashimoto, Duk Ju Na, Keiichirou Kata, Andy Yong, Toshihiko Ochiai
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Increasing demand for advanced electronic products with a smaller form factor, superior functionality and performance with a lower overall cost has driven semiconductor industry to develop more innovative and emerging advanced packaging technologies.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d521e83b88350519d8499c7b48fa5c40
https://doi.org/10.1109/ectc.2014.6897346
https://doi.org/10.1109/ectc.2014.6897346