Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Won Joon Kang"'
Autor:
Sung Jun Ahn, Mi-Suk Park, Kyung Ah Kim, Jun Yong Park, Inseong Kim, Won Joon Kang, Seung-Koo Lee, Myeong-Jin Kim
Publikováno v:
PLoS ONE, Vol 8, Iss 8, p e71571 (2013)
OBJECTIVES: Glucose metabolism, perfusion, and water diffusion may have a relationship or affect each other in the same tumor. The understanding of their relationship could expand the knowledge of tumor characteristics and contribute to the field of
Externí odkaz:
https://doaj.org/article/10b603bcd6544a5293994782bca50bfd
Autor:
Joon Koo Han, Jeong Min Lee, Kyung-Sook Shin, Se Hyung Kim, Kyunghee C. Cho, Byung Ihn Choi, Jae Young Lee, Won Joon Kang, Jin-Young Jang
Publikováno v:
European Radiology. 16:1887-1897
The aim of this study is to retrospectively evaluate intrapancreatic accessory spleen (IPAS) with mutidetector computed tomography (MDCT) and superparamagnetic iron oxide (SPIO)-enhanced magnetic resonance imaging (MRI) with emphasis on the role of S
Autor:
Kyung Ah Kim, Seung Koo Lee, Jun Yong Park, Mi-Suk Park, Sung Jun Ahn, In Seong Kim, Won Joon Kang, Myeong-Jin Kim
Publikováno v:
PLoS ONE
Objectives Glucose metabolism, perfusion, and water diffusion may have a relationship or affect each other in the same tumor. The understanding of their relationship could expand the knowledge of tumor characteristics and contribute to the field of o
Autor:
Ahmer Syed, Chang Gyun Ryu, TaeSeong Kim, Eun Sook Sohn, Se Woong Cha, J. Scanlan, Won Joon Kang
Publikováno v:
2008 58th Electronic Components and Technology Conference.
This paper presents a collection of test data showing how the choice of package design and material can have a different effect on performance depending on the loading conditions. Board level temperature cycling, drop (JESD22-B111), and cyclic bend (
Autor:
Won Joon Kang, Tae Kyung Hwang, Chan Ha Hwang, JoonYeob Lee, Eun Sook Sohn, Se Woong Cha, Choon Heung Lee
Publikováno v:
2007 International Conference on Electronic Materials and Packaging.
In spite of a great success of stacked package (PoP) in the market, some reliability issues about package on package (PoP) have been raised by several customers. To guarantee a high reliability in board level performances, many process and material d
Autor:
Syed, A., Scanlan, J., Se Woong Cha, Won Joon Kang, Eun Sook Sohn, Tae Seong Kim, Chang Gyun Ryu
Publikováno v:
2008 58th Electronic Components & Technology Conference; 2008, p1453-1461, 9p
Autor:
Tae Kyung Hwang, Eun Sook Sohn, Won Joon Kang, Se Woong Cha, Joon Yeob Lee, Chan Ha Hwang, Choon Heung Lee
Publikováno v:
2007 International Conference on Electronic Materials & Packaging; 2007, p1-7, 7p
Autor:
Se Hyung Kim, Jeong Min Lee, Joon Koo Han, Jae Young Lee, Won Joon Kang, Jin Young Jang, Kyung-Sook Shin, Kyunghee C. Cho, Byung Ihn Choi
Publikováno v:
European Radiology; Sep2006, Vol. 16 Issue 9, p1887-1897, 11p, 4 Diagrams, 3 Charts, 2 Graphs
Autor:
Jin-Young Kim, Won-Joon Kang, Yoon-Hyun Ka, Yong-Joon Kim, Eun-Sook Sohn, Sung-Su Park, Jae-Dong Kim, Choon-Heung Lee, Yoshida, A., Syed, A.
Publikováno v:
2004 Proceedings 54th Electronic Components & Technology Conference (IEEE Cat. No.04CH37546); 2004, p624-624, 1p