Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Wolfram Steller"'
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::764a772f811e7417679133e43b4a8275
https://doi.org/10.1109/estc55720.2022.9939408
https://doi.org/10.1109/estc55720.2022.9939408
Autor:
Klaus-Dieter Lang, Gerd Schlottig, M. Jurgen Wolf, Wolfram Steller, Frank Windrich, Stephen Robertson, Thomas Brunschwiler, J. Keller, Raul Mrosko, Hermann Oppermann, Douglas Bremner
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
High operation temperatures are a main impact factor for long-term reliability. An efficient cooling approach is crucial especially for high performance computing processors (HPC). As reference, the “International Technology Roadmap for Semiconduct
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dde94ce59c819c7e6886aa4e603e3370
https://doi.org/10.1109/estc.2018.8546344
https://doi.org/10.1109/estc.2018.8546344
Autor:
Thomas Brunschwiler, Raul Mrosko, Jurgen Keller, Wolfram Steller, Jessica Kleff, Stephen Robertson, Gerd Schlottig, Hermann Oppermann
Publikováno v:
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Heat dissipation of integrated circuits is established through the die back-side. In this study, we demonstrate dual-side heat removal from the chip front- and back-side. The key enabling element is a silicon interposer with embedded micro-channels b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e947bc89e9129c4c086551b136f381f
https://doi.org/10.1109/itherm.2018.8419609
https://doi.org/10.1109/itherm.2018.8419609
Publikováno v:
2018 Pan Pacific Microelectronics Symposium (Pan Pacific).
Heterogeneous integration of different devices by using 3D architectures allows the realization of application specific System in Packages (SiP) with a high functionality in a cost effective way. Enabling building blocks technologies are substrate-,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed8e9bb9b868859508dce47e9cbb1b00
https://doi.org/10.23919/panpacific.2018.8318987
https://doi.org/10.23919/panpacific.2018.8318987
Autor:
Florian Krismer, D. Bremner, Gerd Schlottig, Pritish R. Parida, Wolfram Steller, Paul McCloskey, Johann W. Kolar, Pedro A. M. Bezerra, Bruno Michel, Thomas Brunschwiler, Hermann Oppermann, Frederic Voiron, J. Kleff, Arvind Sridhar, Patrick Ruch, Zoran Pavlovic, Mohamed Mehdi Jatlaoui, Neil Ebejer
Publikováno v:
2017 IEEE International Electron Devices Meeting (IEDM).
Novel heat removal and power delivery topologies are required to enable ‘extreme 3D integration’ with cube-sized compute nodes. Therefore, a technology roadmap is presented supporting memory-on-logic and logic-on-logic in the medium and long-term
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::182bb04da667a16ecc44b11e94079cc2
https://doi.org/10.1109/iedm.2017.8268322
https://doi.org/10.1109/iedm.2017.8268322
Publikováno v:
2017 40th International Spring Seminar on Electronics Technology (ISSE).
With decreasing solder volumes and joint sizes, new aspects in electronics packaging occur. Previous publications report porous structures in Cu/Sn microbump interconnects after flux-assisted bonding and storage. The origin and mechanisms of pore for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e1be49d0338f06934eb2fa003fa210e5
https://doi.org/10.1109/isse.2017.8000909
https://doi.org/10.1109/isse.2017.8000909
Autor:
R. Mrossko, Wolfram Steller, Hermann Oppermann, Thomas Brunschwiler, Gerd Schlottig, J. Keller, J. Kleff
Publikováno v:
2016 6th Electronic System-Integration Technology Conference (ESTC).
Interlayer cooling has been demonstrated to enable heat removal scaling in true 3D integration. This technology will unavoidably expose tier interconnects to coolant. If using electrically conductive liquids, such as water based coolants, the interco
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e85b10c7be9986a026e8290e5d016e6d
https://doi.org/10.1109/estc.2016.7764489
https://doi.org/10.1109/estc.2016.7764489
Publikováno v:
Histopathology. 60:1084-1098
Einenkel J, Braumann U-D, Steller W, Binder H & Horn L-C (2012) Histopathology 60, 1084–1098 Suitability of infrared microspectroscopic imaging for histopathology of the uterine cervix Aims: Infrared microspectroscopy (IR-MSP) has been proposed for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c01be3772fd91269fcbd8a53c5465b06
https://doi.org/10.1111/j.1365-2559.2011.04140.x
https://doi.org/10.1111/j.1365-2559.2011.04140.x
Autor:
M. Jurgen Wolf, Matthias Petzold, Wolfram Steller, Falk Naumann, Peter Czurratis, Frank Altmann, Sebastian Brand, T. Appenroth
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
3D-integration is one of the most challenging approaches addressed by researchers in the field of microelectronics in the recent years. With the intension on integrating different components in three dimensions in one device performance and functiona
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::66c093dca7c7ff22bbd0724c512f97ba
https://doi.org/10.1109/ectc.2015.7159570
https://doi.org/10.1109/ectc.2015.7159570
Autor:
M. Juergen Wolf, Wolfram Steller, Knut Gottfried, Wolfgang Gunther, K. Dieter Lang, Christoph Meinecke, Gregor Woldt
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
The applications of inertial sensors have a wide variety in terms of accuracy and costs. A new technology approach is joining higher sensor accuracy and lower production costs by using a new Interposer / sensor interconnect technology applied on 300
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0cf5a637e2ca21a3acb7f531a57ab4c1
https://doi.org/10.1109/ectc.2014.6897446
https://doi.org/10.1109/ectc.2014.6897446