Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Wolfgang Buter"'
Publikováno v:
ReCoSoC
Optical on-chip communication technology provides an unprecedented bandwidth. It allows to connect the hundreds or even thousands of processing elements expected in many core systems using optical Network-on-Chip. However, the required buffers to int
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0eb4397bd615a1a41f6bd1d0cb5cae7b
https://doi.org/10.1109/recosoc.2016.7533909
https://doi.org/10.1109/recosoc.2016.7533909
Autor:
S. Mahmood, Alberto Garcia-Ortiz, V. V. Parsi Sreenivas, S. Arefin, R.B. Bergman, Wolfgang Buter, A. Ali
Publikováno v:
FPL
A rapid-prototyping framework for nano-photonic accelerators embedded in digital multiprocessor systems is highly desired. Nano-photonic technologies advance at a fast pace. They provide a promising technological substrate for implementing on-chip op
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68b5bab8ad76dd8c2a62429707c03a26
https://doi.org/10.1109/fpl.2015.7294004
https://doi.org/10.1109/fpl.2015.7294004
Publikováno v:
ReCoSoC
Enhancing an electrical NoC with a reconfigurable nano-photonic interconnect architecture contributes to mitigate the bandwidth bottleneck typically found in modern systems. The management of such photonic channels, however, complicates the control o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::259ee569f086e3905709f7c736e412c7
https://doi.org/10.1109/recosoc.2015.7238096
https://doi.org/10.1109/recosoc.2015.7238096
Publikováno v:
ReCoSoC
Optical network-on-chips (oNoCs) are a promising candidate to replace electrical NoCs in many-core systems. Nanophotonic components provide high bandwidth and short transmission delay but they are very sensitive to the temperature. Temperature gradie
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::483214782eb47b322c06b78d14708c4b
https://doi.org/10.1109/recosoc.2015.7238081
https://doi.org/10.1109/recosoc.2015.7238081
Publikováno v:
ReCoSoC
Redundant through-silicon-vias (TSV) are essential to cope with the relatively low yield of current 3-D technologies. In this work we propose a redundant approach for 3-D integrated circuits based on coding. In contrast to conventional redundancy sch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f1bc654b877471de408d4e4baa133ccc
https://doi.org/10.1109/recosoc.2014.6861355
https://doi.org/10.1109/recosoc.2014.6861355
Publikováno v:
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2014.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::30ffead515494ed2cb9046914c1f8fd6
https://doi.org/10.7873/date.2014.322
https://doi.org/10.7873/date.2014.322