Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Woei-Jye Ong"'
Autor:
Woei-Jye Ong, 王偉杰
98
Passive RFID tag typically consists of an inert carrier substrate, an antenna and a semiconductor chip. In future, qualification process of the passive RFID tags will includes in damp heat storage and liquid nitrogen environment storage test
Passive RFID tag typically consists of an inert carrier substrate, an antenna and a semiconductor chip. In future, qualification process of the passive RFID tags will includes in damp heat storage and liquid nitrogen environment storage test
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/39483037933850981295
Publikováno v:
2009 11th Electronics Packaging Technology Conference.
In this study, a capping layer was deposited after CMP polish when finish the SiO 2 layer. These interrelated problems can be solved with a proper fabrication process strategy. This effective strategy will eliminate copper extrusion using in many sem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ed47d554d95dc44e08a5dafb2d0f245
https://doi.org/10.1109/eptc.2009.5416583
https://doi.org/10.1109/eptc.2009.5416583
Publikováno v:
2009 3rd International Conference on Anti-counterfeiting, Security, and Identification in Communication.
Driver fatigue is a key factor of accident. Recently, there is a system using RFID combined with a wireless accelerometer sensor module used for doze detector has become an important issue. It is because that about ten percent of the dead drivers wer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::37610807366d65658e5aa453165cdb9b
https://doi.org/10.1109/icasid.2009.5276929
https://doi.org/10.1109/icasid.2009.5276929
Autor:
Po-Ying Chen, Wen-Kuan Yeh, Ming Hsiung Tsai, I-Fen Chen, Po-Han Wu, Woei-Jye Ong, Shih-Chun Hung, Wei-Chou Chen, Kang-Ping Li, Pei-Chen Yeh, Hsin-Ying Huang
Publikováno v:
Journal of Studies on Manufacturing; Apr/Jun2010, Vol. 1 Issue 2/3, p85-90, 6p, 3 Black and White Photographs, 3 Diagrams, 4 Graphs
Publikováno v:
11th Electronics Packaging Technology Conference, 2009. EPTC '09; 2009, p7-9, 3p