Test Results of Sintered Nanosilver Paste Die Attach for High-Temperature Applications.

Autor: Croteau, Paul, Seal, Sayan, Witherell, Ryan, Glover, Michael, Krishnamurthy, Shashank, Mantooth, Alan

Publikováno v: Journal of Microelectronic & Electronic Packaging; 2016 1st Quarter, Vol. 13 Issue 1, p6-16, 11p