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pro vyhledávání: '"Wiswell Nicholas"'
Autor:
Wiswell Nicholas, Prayudi Lianto, Masaya Kawano, Xiangyu Wang, Vivek Chidambaram, Gilbert See
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Wide range of choices are available for dielectric materials selection for hybrid bonding, which include: thermal oxide, PECVD TEOS SiO 2 , SiN, SiCN and commercial polymer dielectrics. Among the polymer dielectrics, two types: high-temperature curab
Autor:
Wiswell, Nicholas A
Publikováno v:
Master's Theses and Project Reports.
A process for micromachining of micro-mirror devices from silicon-on-insulator wafers was proposed and implemented. Test methods and force applicators for these devices were developed. Following successful fabrication of these devices, a novel proces