Výsledky vyhledávání - "Wissam Sabbah"

High temperature ageing of microelectronics assemblies with SAC solder joints

Autor: Hervé Morel, Pierre Bondue, Wissam Sabbah, Alexandrine Guédon-Gracia, Hélène Fremont, Cyril Buttay, Oriol Avino-Salvado

Publikováno v: Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2017, ⟨10.1016/j.microrel.2017.06.065⟩

International audience; In some applications, electronic systems are expected to operate at high ambient temperature (e.g. 150 °C). In this paper, we investigate the failure mechanism and microstructure evolution of solder-free (SAC) solder joints a

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7dbf82ba4ce31bc009451dd51b700416
https://doi.org/10.1016/j.microrel.2017.06.065

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Identification and analysis of power substrates degradations subjected to severe aging tests

Autor: Stephane Azzopardi, L. Theolier, Eric Woirgard, Wissam Sabbah, Donatien Martineau, F. Arabi

Publikováno v: Microelectronics Reliability. 55:1961-1965

Severe thermal cycles [− 55 °C/+ 245 °C] have highlighted degradations in Active Metal Brazing Si3N4 power substrates with copper metallization, nickel-plated and gold finish. After 1000 thermal cycles, the metallization patterns of the top side

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::c82fc69e63dfc76102c066d1a4545bac
https://doi.org/10.1016/j.microrel.2015.06.048

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Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles

Autor: Jianfeng Li, Stephane Azzopardi, Wissam Sabbah, Cyril Buttay, Christopher Mark Johnson

Publikováno v: Journal of Materials Processing Technology
Journal of Materials Processing Technology, Elsevier, 2015, pp.299-308. ⟨10.1016/j.jmatprotec.2014.08.002⟩

3mm×3mm dummy SiC dies with 100\200\200nm thick Ti\W\Au metallization have simultaneously been attached using sintering of Ag nanoparticle paste on AlN-based direct bonded copper substrates with 5\0.1μm thick NiP\Au finish. The effect of preparatio

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b25d6fbef01d80ef2daf0fcc56b87f64

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Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling

Autor: Cyril Buttay, Wissam Sabbah, Hervé Morel, L. Theolier, Oriol Avino-Salvado, F. Arabi

Publikováno v: Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2017, ⟨10.1016/j.microrel.2017.06.091⟩

International audience; We investigate the effect of three testing conditions (thermal shock, Rapid Temperature Changes – RTC – and high temperature storage) on the interconnects of a power electronic module. In particular, the mechanical strengt

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c429c722821a97275babec6861d2ecf6
https://hal.archives-ouvertes.fr/hal-01562549/file/AuSn_ageing.pdf

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Die attach using silver sintering. Practical implementation and analysis

Autor: Wissam Sabbah, Cyril Buttay, Régis Meuret, Hervé Morel, Dominique Planson, Amandine Masson, Raphaël Riva, Stephane Azzopardi

Publikováno v: European Journal of Electrical Engineering
European Journal of Electrical Engineering, Lavoisier, 2013, 16 (3-4), pp.293-305. ⟨10.3166/ejee.16.293-305⟩

National audience; Silver sintering is a promising alternative to high melting point (HMP) solders which contain lead. Indeed, it offers better thermal and electrical properties, and can operate at higher temperature. Currently, several implementatio

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c4001f138e590ec0d6125333d3430e46
https://doi.org/10.3166/ejee.16.293-305

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Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy

Autor: Eric Woirgard, Régis Meuret, Stephane Azzopardi, Wissam Sabbah, Cyril Buttay

Publikováno v: Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2013, 53 (9-11), pp.1617-1621. ⟨10.1016/j.microrel.2013.07.101⟩

International audience; Silver sintering joints and AuGe soldering are promising technologies for high temperature (>200 °C ambient) power electronics packaging. This paper presents the implementation of two silver-sintering processes with the one h

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4e7360d02bde8e615bfff00097938ff7
https://hal.archives-ouvertes.fr/hal-00881584

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Report de puce par frittage d'argent - mise en oeuvre et analyse

Autor: Amandine Masson, Wissam Sabbah, Raphaël Riva, Cyril Buttay, Stephane Azzopardi, Hervé Morel, Dominique Planson, Régis Meuret

Publikováno v: HAL
Actes de Electronique de Puissance du Futur 2012
14ème EPF
14ème EPF, Jul 2012, Bordeaux, France. pp.CD (ref 61)

International audience; Le frittage d'argent est un candidat prometteur pour remplacer les brasures haute température au plomb. Il offre en effet de meilleures performances thermiques, électriques, fonctionne à plus haute température. Plusieurs s

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::15f4f007f5376db28db34afc7ce632a7
https://hal.science/hal-00729156

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