Zobrazeno 1 - 10
of 76
pro vyhledávání: '"Wiren D. Becker"'
Autor:
Sung Kyu Lim, Madhavan Swaminathan, Jinwoo Kim, Wiren D. Becker, Jose A. Hejase, Majid Ahadi Dolatsara
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 63:246-258
One of the favorable tools for signal integrity evaluation is eye diagram analysis. This is traditionally performed with a lengthy transient simulation, which can be prohibitively time consuming for complex high-speed channels with a low bit error ra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::119b8cd664cbf936c4a0b6387a34fc70
https://doi.org/10.1109/temc.2020.3012960
https://doi.org/10.1109/temc.2020.3012960
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1276-1295
In this article, we cover the fundamentals of neural networks and Bayesian learning with a focus on signal and power integrity problems arising in packaging. Rather than only focus on mathematical formulations, we explain the important concepts and t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::79671dd38705bfb7abbfed7a2e839b26
https://doi.org/10.1109/tcpmt.2020.3011910
https://doi.org/10.1109/tcpmt.2020.3011910
Autor:
Wiren D. Becker, James L. Drewniak, Bruce Archambeault, Siqi Bai, Albert E. Ruehli, Samuel Connor, Matteo Cocchini, Jonghyun Cho, Biyao Zhao
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 62:1266-1277
A physics-based circuit modeling methodology for system-level power integrity (PI) analysis and design is presented herein. The modeling methodology is based on representing the current paths in the power distribution network (PDN) with appropriate c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8185d3a4576187bb47630bf181c8d9be
https://doi.org/10.1109/temc.2019.2927742
https://doi.org/10.1109/temc.2019.2927742
Autor:
Pavel Roy Paladhi, Hakki Mert Torun, Madhavan Swaminathan, Wiren D. Becker, Xianbo Yang, Jose A. Hejase, Yanyan Zhang, Junyan Tang
Publikováno v:
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97fb8ed310b17a7262ca60a02942a265
https://doi.org/10.1109/epeps51341.2021.9609205
https://doi.org/10.1109/epeps51341.2021.9609205
Autor:
Daniel M. Dreps, Mahesh Bohra, Wiren D. Becker, Dierk Kaller, Jose A. Hejase, Xiaomin Duan, Xianbo Yang, Yanyan Zhang, Junyan Tang
Publikováno v:
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3bfd9d457f50e41f38c0006270e2b10c
https://doi.org/10.1109/epeps51341.2021.9609151
https://doi.org/10.1109/epeps51341.2021.9609151
Autor:
Xianbo Yang, Osama Waqar Bhatti, Madhavan Swaminathan, Nikita Ambasana, Pavel Roy Paladhi, Wiren D. Becker, Majid Ahadi Dolatsara
Publikováno v:
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::892daf47fff18ee76aa689bfe793a63d
https://doi.org/10.1109/epeps51341.2021.9609225
https://doi.org/10.1109/epeps51341.2021.9609225
Autor:
Daniel M. Dreps, Mahesh Bohra, Lloyd A. Walls, Wiren D. Becker, Xianbo Yang, Yanyan Zhang, Junyan Tang
Publikováno v:
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::23b533814d39bddcb7ab49a80b1f13e9
https://doi.org/10.1109/epeps51341.2021.9609136
https://doi.org/10.1109/epeps51341.2021.9609136
Autor:
Berge Layne A, James L. Drewniak, Matthew S. Doyle, Matteo Cocchini, Wiren D. Becker, Schoneck Kyle, Siqi Bai, Samuel Connor
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
A method to model, measure, and characterize a high-transient current in an electrical packaging solution is described herein. These methods help overcome the challenge of generating model to hardware correlation in high current applications. A speci
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4956038ad943986832cca434d5f515fe
https://doi.org/10.1109/ectc32696.2021.00212
https://doi.org/10.1109/ectc32696.2021.00212
Publikováno v:
IEEE Access, Vol 7, Pp 53629-53640 (2019)
Estimation of jitter and eye diagram in high-speed serial channels can be challenging. The existing methods might fail to show inter-symbol interference (ISI) and data dependent jitter because they are either excessively time consuming or only applic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::70737f32579d971c3142778c913a04ff
https://ieeexplore.ieee.org/document/8678746/
https://ieeexplore.ieee.org/document/8678746/
Publikováno v:
2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).
Designing CTLE of high-speed channels can be complicated and time consuming. To alleviate this issue, this paper investigates the invertible neural networks (INNs) for inverse design of the CTLE. In this approach, a desired eye height and eye width i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a805de6ebea6fee9e97e52c7197c1c41
https://doi.org/10.1109/edaps50281.2020.9312919
https://doi.org/10.1109/edaps50281.2020.9312919