Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Winstel, Kevin"'
Autor:
Sakuma, Katsuyuki, Skordas, Spyridon, Zitz, Jeffrey, Perfecto, Eric, Guthrie, William, Guerin, Luc, Langlois, Richard, Liu, Hsichang, Ramachandran, Koushik, Lin, Wei, Winstel, Kevin, Kohara, Sayuri, Sueoka, Kuniaki, Angyal, Matthew, Graves-Abe, Troy, Berger, Daniel, Knickerbocker, John, Iyer, Subramanian
Publikováno v:
2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p647-654, 8p
Autor:
Batra, Pooja, Skordas, Spyridon, LaTulipe, Douglas, Winstel, Kevin, Kothandaraman, Chandrasekharan, Himmel, Ben, Maier, Gary, He, Bishan, Gamage, Deepal Wehella, Golz, John, Wei Lin, Vo, Tuan, Priyadarshini, Deepika, Hubbard, Alex, Cauffman, Kristian, Peethala, Brown, Barth, John, Kirihata, Toshiaki, Graves-Abe, Troy, Robson, Norman
Publikováno v:
Journal of Low Power Electronics & Applications; Jun2014, Vol. 4 Issue 2, p77-89, 13p
Autor:
Lin, Wei, Faltermeier, Johnathan, Winstel, Kevin, Skordas, Spyridon, Graves-Abe, Troy, Batra, Pooja, Herman, Kenneth, Golz, John, Kirihata, Toshiaki, Garant, John, Hubbard, Alex, Cauffman, Kris, Levine, Theodore, Kelly, James, Priyadarshini, Deepika, Peethala, Brown, Patlolla, Raghuveer, Shoudy, Matthew, Demarest, James J, Wynne, Jean
Publikováno v:
2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S); 2014, p1-3, 3p
Autor:
Rubin, Joshua, Winstel, Kevin, Hubbard, Alex, Murray, Cody, Chung, Kisup, Kelly, James, Khan, Babar, Kumar, Arvind, Paruchuri, Vamsi
Publikováno v:
2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S); 2015, p1-2, 2p
Autor:
Batra, Pooja, LaTulipe, Douglas, Skordas, Spyridon, Winstel, Kevin, Kothandaraman, Chandrasekharan, Himmel, Ben, Maier, Gary, He, Bishan, Gamage, Deepal Wehella, Golz, John, Lin, Wei, Vo, Tuan, Priyadarshini, Deepika, Hubbard, Alex, Cauffman, Kristian, Peethala, Brown, Barth, John, Kirihata, Toshiaki, Graves-Abe, Troy, Robson, Norman
Publikováno v:
2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S); 2013, p1-2, 2p
Autor:
Wei Lin, Juntao Li, Washington, Joseph, Rath, David, Skordas, Spyridon, Kirihata, Toshiaki, Winstel, Kevin, Peethala, Brown, Demarest, James, Da Song, Edelstein, Daniel, Iyer, Subramanian
Publikováno v:
2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D); 2014, p6-6, 1p