Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Winson Lua"'
Autor:
V. K. Ravikumar, Jiann Min Chin, Winson Lua, Nathan Linarto, Gopinath Ranganathan, Jonathan Trisno, K. L. Pey, Joel K. W. Yang
Publikováno v:
Nature Communications, Vol 13, Iss 1, Pp 1-8 (2022)
Laser probing of integrated circuits using sub-bandgap photon energies remains a challenge. Here, the authors propose a super-resolution method capable of achieving probe placement accuracy to better than 10 nm; extraction of electro-optic waveforms
Externí odkaz:
https://doaj.org/article/a0f43b1fc1c741128dc262efb368d7f7
Publikováno v:
EDFA Technical Articles. 20:10-16
This article explains how laser voltage probing (LVP) can be used to analyze combinational logic circuits. The authors describe how the technique is aided by the development and use of a waveform library and a corresponding truth table. They also pre
Autor:
Vasanth Somasundaram, Chua Choon Meng, Angeline Phoa, Winson Lua, Seah Yi Xuan, Venkat Krishnan Ravikumar
Publikováno v:
2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA).
As the technology node shrinks, the choice of laser for performing fault isolation becomes critical. The conventionally used 1319nm laser has spatial resolution constraint at smaller geometries. The 1064nm laser provides resolution improvement at the
Autor:
Angeline Phoa, Venkat Krishnan Ravikumar, Abel Tan, Winson Lua, A S Girish, Gopinath Ranganathan
Publikováno v:
Microelectronics Reliability. 106:113584
Analog circuits are often challenging to debug with dynamic laser stimulation (DLS) due to intrinsic sensitivity of some circuitries to carrier generations. This paper showcases successful post‑silicon debug on analog circuitries (start-up circuit)
Publikováno v:
2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
This paper provides an overview on the bandwidth of the photodetector used in the laser voltage probing (LVP) and laser voltage imaging (LVI) tools. A photodetector's bandwidth affects sensitivity, signal-to-noise ratio (SNR) and measurable slew rate
Publikováno v:
2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
This paper highlights systematic fault isolation approaches to identify back-end of line metal bridging through the combination of techniques such as photon emission, soft defect localization, laser voltage probing as well as combinational logic anal
Publikováno v:
2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Combinational logic analysis has been introduced to improve fault isolation when using laser voltage probing on standard cells. The technique has been shown to offer more reliable isolation within a shorter time thereby increasing FI efficiency. This
Publikováno v:
International Symposium for Testing and Failure Analysis.
Laser Voltage Probing (LVP) using continuous-wave near infra-red lasers are popular for failure analysis, design and test debug. LVP waveforms provide information on the logic state of the circuitry. This paper aims to explain the waveforms observed