Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Winnie Lu"'
Autor:
Yan-Jun Fan, John H. Lau, Kai-Ming Yang, Hsing-Ning Liu, Tzvy-Jang Tseng, Eagle Lin, Puru Bruce Lin, Curry Lin, Leo Chang, Jean-Jou Chen, Po-Chun Huang, Cheng-Ta Ko, Tim Xia, Winnie Lu, Chia-Yu Peng
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 18:29-39
In this study, the reliability of the solder joints of a heterogeneous integration of one large chip (10 × 10 mm) and two smaller chips (7 × 5 mm) by a fan-out method with a redistribution layer-first substrate fabricated on a 515 × 510-mm panel i
Autor:
Tim Xia, David Cheng, Kai-Ming Yang, Yan-Jun Fan, Puru Bruce Lin, Tzvy-Jang Tseng, John H. Lau, Winnie Lu, Cheng-Ta Ko, Chia-Yu Peng, Curry Lin, Leo Chang, Hsing Ning Liu, Eagle Lin
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 18:67-80
In this study, the reliability of the solder joints of a six-side molded panel-level chip-scale package (PLCSP) is investigated. Emphasis is placed on the thermal cycling test (−55°C Δ 125°C, 50-min cycle) of the six-side molded PLCSP on a print
Autor:
Winnie Luiza dos Santos Clímaco, Itallo Conrado Sousa Araújo, Kamilla Ribas Soares, Edgard Onoda Luiz Caldas, Fernanda Lima de Souza Castro, Henrique Carneiro Lobato, Mariana Cristina Vieira, Leonardo José Camargos Lara
Publikováno v:
Revista Brasileira de Zootecnia, Vol 53 (2024)
ABSTRACT This study examined the impact of a 37.5 °C temperature on chick embryos during the hatching period (18-21 days of incubation) and its subsequent effect on hatchery results and the thermotolerance of broiler chicks from 28-40 days of rearin
Externí odkaz:
https://doaj.org/article/654a2e02b8d945bba66a7cc92d301081
Autor:
John H. Lau, Cheng-Ta Ko, Tzvy-Jang Tseng, Chia-Yu Peng, Kai-Ming Yang, Tim Xia, Puru Bruce Lin, Eagle Lin, Leo Chang, Hsing Ning Liu, Curry Lin, David Cheng, Winnie Lu
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 17:111-120
In this study, the design, materials, process, assembly, and reliability of a six-side molded panel-level chip-scale package (PLCSP) are presented. Emphasis is placed on the fabrication of the redistribution layers (RDLs) of the PLCSP on a large temp
Autor:
Tzvy-Jang Tseng, John H. Lau, Tim Xia, Chia-Yu Peng, Kai-Ming Yang, Po-Chun Huang, Cheng-Ta Ko, Puru Bruce Lin, Jean-Jou Chen, Eagle Lin, Winnie Lu, Curry Lin, Leo Chang
Publikováno v:
International Symposium on Microelectronics. 2020:000042-000050
In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the materials, process, fabrication, and reliability of a heterogeneous in
Autor:
Eagle Lin, Kai-Ming Yang, John H. Lau, Curry Lin, Leo Chang, Puru Bruce Lin, David Cheng, Tim Xia, Winnie Lu, Hsing Ning Liu, Chia-Yu Peng, Tzvy-Jang Tseng, Cheng-Ta Ko
Publikováno v:
International Symposium on Microelectronics. 2020:000057-000066
In this study, the design, materials, process, assembly, and reliability of a 6-side molded panel-level chip scale package (PLCSP) are presented. Emphasis is placed on the fabrication of the RDLs (redistribution layers) of the PLCSP on a large tempor
Autor:
Puru Bruce Lin, Jean-Jou Chen, John H. Lau, Cheng-Ta Ko, Po-Chun Huang, Curry Lin, Yan-Jun Fan, Leo Chang, Kai-Ming Yang, Tim Xia, Chia-Yu Peng, Winnie Lu, Eagle Lin, Hsing-Ning Liu, Tzvy-Jang Tseng
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this study, the reliability of the solder joints of a heterogeneous integration of one large chip and two smaller chips by a fan-out method with a redistribution-layer (RDL)-first substrate fabricated on a panel is investigated. Emphasis is placed
Autor:
Hsing Ning Liu, Puru Bruce Lin, Winnie Lu, Tzvy-Jang Tseng, Curry Lin, Leo Chang, Yan-Jun Fan, John H. Lau, Cheng-Ta Ko, Eagle Lin, David Cheng, Tim Xia, Kai-Ming Yang, Chia-Yu Peng
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this study, the reliability of the solder joints of a 6-side molded panel-level chip-scale package (PLCSP) is investigated. Emphasis is placed on the thermal cycling test ( $-55^{\circ}\mathrm{C}\leftrightarrows 125^{\circ}\mathrm{C}$ , 50-minute
Autor:
Prasidh Chhabria, Winnie Lu
Publikováno v:
Lecture Notes in Computer Science ISBN: 9783030504250
ICCS (5)
ICCS (5)
The fixation probability of a mutation in a population network is a widely-studied phenomenon in evolutionary dynamics. This mutation model following a Moran process finds a compelling application in modeling information propagation through human net
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bddd712de3a6d6beff7b1295f607f0d3
https://doi.org/10.1007/978-3-030-50426-7_14
https://doi.org/10.1007/978-3-030-50426-7_14
Autor:
April Schweinhart, Katharine Atwood, Camila Aramburu, Rachel Bauer, Winnie Luseno, Ashley Simons-Rudolph
Publikováno v:
International Journal of Qualitative Methods, Vol 22 (2023)
Although researchers have convened focus groups to collect individuals’ opinions for some time, many have transitioned data collection from in-person to online groups. Online focus groups became even more important as COVID-19-related restrictions
Externí odkaz:
https://doaj.org/article/842129138c6f44bbad91f53fec14746c