Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Windsor Pipes Thomas"'
Autor:
Rachel Lu, Yu-Hua Chen, Dyi-Chung Hu, Ravindra Vaman Shenoy, Aric Shorey, Urmi Ray, Kwan-Yu Lai, Shaun Hsu, Windsor Pipes Thomas
Publikováno v:
International Symposium on Microelectronics. 2014:000397-000401
For high density interconnection IC packages of the future, the outlook is for thinner packages with higher routing densities. With that, managing the substrate warpage becomes critical. Traditional organic substrates may face several challenges for
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000989-001008
Glass carriers have proven to provide a solution for carriers during wafer thinning operations for 3D-IC (Three-Dimensional Integrated Circuit). The attributes of the glass carrier, such as total thickness variation (TTV), flatness and properties suc
Publikováno v:
International Symposium on Microelectronics. 2012:000760-000764
Autor:
Aric Shorey, Cheolbok Kim, Hyup Jong Kim, David E. Senior, Windsor Pipes Thomas, Yong-Kyu Yoon
Publikováno v:
Scopus2-s2.0-84907893946
64th Electronic Components and Technology Conference, ECTC 2014
64th Electronic Components and Technology Conference, ECTC 2014
High quality and compact RF devices, using the half mode substrate integrated waveguide (HMSIW) architecture loaded with a complementary split ring resonator (CSRR), are implemented on a glass interposer layer, which therefore serves as an interconne
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1cb5a5cbc3bc7ab8e5b313de28fbe11c
https://hdl.handle.net/20.500.12585/9063
https://hdl.handle.net/20.500.12585/9063