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pro vyhledávání: '"Wim Huwel"'
Publikováno v:
ECS Transactions. 18:707-712
This paper presents a technology for the 3D-integration of a TI-MSP430 low-power microcontroller inside conventional double sided flex substrates, for a wearable wireless ECG system. The devices are first thinned down to 25 µm and next integrated as
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::35443f9e49f6e6dfed8ea5cbbb292177
https://doi.org/10.1149/1.3096525
https://doi.org/10.1149/1.3096525
