Zobrazeno 1 - 10
of 35
pro vyhledávání: '"Wim Christiaens"'
Autor:
Mehrnaz Hashemiesfahan, Jo Wim Christiaens, Antonio Maisto, Pierre Gelin, Han Gardeniers, Wim De Malsche
Publikováno v:
Micromachines, Vol 15, Iss 7, p 868 (2024)
Lateral flow membrane microdevices are widely used for chromatographic separation processes and diagnostics. The separation performance of microfluidic lateral membrane devices is determined by mass transfer limitations in the membrane, and in the li
Externí odkaz:
https://doaj.org/article/1fa8bfcdfe4441829e4103d4e152b9a6
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
The continuous drive to have smart flexible systems in different application areas as automotive, households, and consumer electronics utilize the development of different integration approaches to include many electronic functionalities in 3D struct
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::58ea69558a625b64421fe86a76b3fbde
https://doi.org/10.1109/estc48849.2020.9229822
https://doi.org/10.1109/estc48849.2020.9229822
Autor:
Pieter Spooren, Wim Christiaens
Publikováno v:
Studies in educational evaluation
Studies in Educational Evaluation, 54, 43-49. Elsevier Limited
Studies in Educational Evaluation, 54, 43-49. Elsevier Limited
Previous research has shown that many student, teacher, and course characteristics are related to SET scores. However, the relationship between students’ perceptions of (the value of) of SET procedures and their SET scores has not yet been studied.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f704b3f965c298442c2254f594920342
https://doi.org/10.1016/j.stueduc.2016.12.003
https://doi.org/10.1016/j.stueduc.2016.12.003
Publikováno v:
The International Journal of Assessment and Evaluation. 20:13-21
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24b6aa5c6797b7887caad84ada9df5cf
https://doi.org/10.18848/2327-7920/cgp/v20i03/48350
https://doi.org/10.18848/2327-7920/cgp/v20i03/48350
Autor:
S. Priyabadini, Wim Christiaens, G. Kunkel, Kristof Dhaenens, A.E. Petersen, S. Van Put, A. Gielen, Jan Vanfleteren
Publikováno v:
Scopus-Elsevier
3D-stacking of Ultra Thin Chip Packages (UTCP’s) – one of the emerging technologies in the field of high density integration - is presented here. This technology is developed to increase the functionality of the electronic devices and to raise th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::640c4384a7bd58978cfa61d10a66c821
https://doi.org/10.4071/isom-2011-wa1-paper3
https://doi.org/10.4071/isom-2011-wa1-paper3
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 33:754-760
Flexible materials, today, are being used already as base substrates for electronic assembly. A lot of mounted components could be integrated in flexible polyimide (PI) substrates. Very interesting advantages of integrating components into the flex a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8104e01eed5a9cd200826fab81ac607d
https://doi.org/10.1109/tcapt.2010.2060198
https://doi.org/10.1109/tcapt.2010.2060198
Publikováno v:
International Journal of Theoretical Physics. 49:3061-3068
In this paper we present Aerts’ vessels of water model which violates Bell inequalities, and discuss how this fits in the Creation Discovery View in the context of the Operational Quantum Logic approach. We analyze the 2 different ways in which cor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83489b45ed091cbba2f7d1310c0dc63f
https://doi.org/10.1007/s10773-010-0487-y
https://doi.org/10.1007/s10773-010-0487-y
Publikováno v:
IEEE Transactions on Advanced Packaging. 33:72-78
This paper describes the fine-pitch interconnection capabilities of the ultra-thin chip packaging (UTCP) technology, a technology under development for embedding thin chips in a flexible polyimide (PI) substrate. It allows for fully flexible electron
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63321c17aef6f8f348823babd6f46dcc
https://doi.org/10.1109/tadvp.2009.2018134
https://doi.org/10.1109/tadvp.2009.2018134
Publikováno v:
Displays. 30:71-76
One of the major problems with PM displays is that, depending on the used display material, only a limited number of lines can be multiplexed. We developed a new driving technology and display setup that takes care of that problem. We divided the dis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::421ed698e3c15c28826aacfd909062e3
https://doi.org/10.1016/j.displa.2008.12.005
https://doi.org/10.1016/j.displa.2008.12.005
Publikováno v:
ECS Transactions. 18:707-712
This paper presents a technology for the 3D-integration of a TI-MSP430 low-power microcontroller inside conventional double sided flex substrates, for a wearable wireless ECG system. The devices are first thinned down to 25 µm and next integrated as
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::35443f9e49f6e6dfed8ea5cbbb292177
https://doi.org/10.1149/1.3096525
https://doi.org/10.1149/1.3096525