Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Wilson Zeng"'
Autor:
Wilson Zeng, John Wei, Azadeh Hoor, Stan Silva, Jane Lou, Bill Broman, Chris Walton, Meghan Hull, Dave Truch
Publikováno v:
Day 1 Mon, May 06, 2019.
Integrity management (IM) is an ongoing lifecycle process for ensuring safe operation and fitness for service of offshore oil and gas production systems, including riser and flowlines. Riser and flowlines offer a means of transporting fluids between
Autor:
Christopher S. Ngai, Huixiong Dai, Scott DeVries, Wilson Zeng, Yongan Xu, Khoi Phan, Indira Seshadri, Luciana Meli, Nelson Felix, Daniel Lee Diehl, Anuja De Silva, Cao Yong, Yann Mignot, M. Stolfi
Publikováno v:
International Conference on Extreme Ultraviolet Lithography 2017.
Extending extreme ultraviolet (EUV) single exposure patterning to its limits requires more than photoresist development. The hardmask film is a key contributor in the patterning stack that offers opportunities to enhance lithographic process window,
Autor:
Shanyu Wang, Michael Yang, Chung Hua, Pete Lembesis, Pakulski Ryan M, Shawming Ma, Yan Chun, Wilson Zeng, Jack Lo
Publikováno v:
ECS Meeting Abstracts. :1095-1095
As semiconductor device scaling marching toward sub-5 nm logic, 128+ layers 3D NAND, and advanced 1x nm DRAM technology nodes, wafer surface cleaning and residue removal in nanoscale, high aspect ratio structures become increasingly critical. Dry cle
Autor:
Ryan Watson, Shilpa Singh, Nag Krishnappa, Neil Simpson, Sandeep Jesudasen, Finlay Baxter, Azadeh Hoor, Wilson Zeng
Publikováno v:
Day 3 Wed, May 07, 2014.
Abstract The majority of the deepwater pipelines operating in the Gulf of Mexico (GoM) carry hydrocarbons at a high pressure and temperature resulting in the system's thermal expansion. In order to relieve the high stresses due to thermal expansion,
Autor:
Cao Yong, Huixiong Dai, Wilson Zeng, Linus Jang, Christopher Dennis Bencher, Ryoung-han Kim, Young Joon Moon, Christopher S. Ngai, Daniel Lee Diehl, Peng Xie
Publikováno v:
SPIE Proceedings.
The Cost of Ownership (CoO) for semiconductor processing has been primarily dominated by lithography. In multiple patterning processes, additional materials and the impact to throughput of multiple patterning passes appear to become additional major
Autor:
De Silva, Anuja, Mignot, Yann, Meli, Luciana, DeVries, Scott, Yongan Xu, Seshadri, Indira, Felix, Nelson M., Wilson Zeng, Yong Cao, Khoi Phan, Huixiong Dai, Ngai, Christopher S., Stolfi, Michael, Diehl, Daniel L.
Publikováno v:
Proceedings of SPIE; 8/14/2017, Vol. 10450, p1-14, 14p