Zobrazeno 1 - 10
of 11
pro vyhledávání: '"William V. McLevige"'
Autor:
D. M. Stephenson, William V. McLevige, Kadri Vural, Gary L. Bostrup, C. Y. Chen, Klaus-Werner Hodapp, Donald E. Cooper, William E. Kleinhans, Donald N. B. Hall, Robert B. Bailey, Lester J. Kozlowski, Scott A. Cabelli
Publikováno v:
SPIE Proceedings.
Rockwell Science Center and the University of Hawaii have developed a short wavelength infrared (SWIR) 1024 x 1024 focalplane array (EPA). The continuing project is funded by the U.S. Air Force Phillips Laboratory in connection with their AdvancedEle
Autor:
Dennis E. Edwall, E. R. Gertner, J. Ellsworth, Stephen R. Hampton, William V. McLevige, A. H.B. Vanderwyck, Edward R. Blazejewski, G. M. Williams, Laura Fishman, Honnavalli R. Vydyanath
Publikováno v:
SPIE Proceedings.
`The demand for high detectivity LWIR IR focal plane arrays that operate at low backgrounds is shown to drive the HgCdTe technology toward increased detector performance. Reduced operating temperature together with advanced material technology and de
Autor:
W. E. Tennant, Kadri Vural, Scott A. Cabelli, Edward R. Blazejewski, Donald E. Cooper, William V. McLevige, Lester J. Kozlowski, A. H.B. Vanderwyck, S. L. Johnston
Publikováno v:
SPIE Proceedings.
Staring 128 X 128 hybrid HgCdTe FPAs have been demonstrated with very good sensitivity and operability at temperatures compatible with thermoelectric cooling (> 160 K). The FPAs consist of HgCdTe/sapphire (PACE-I; producible alternative to CdTe for e
Autor:
William V. McLevige, A. H.B. Vanderwyck, Kadri Vural, Lester J. Kozlowski, Donald E. Cooper, W. E. Tennant, Scott A. Cabelli, Edward R. Blazejewski
Publikováno v:
Optical Engineering. 33:704
Cost-effective high-performance IR imaging cameras need affordable staring focal plane arrays (FPAs) that can operate effectively at temperatures compatible with inexpensive long-life coolers. We report on staring hybrid 128 x 128 and 256 x 256 Hg1-x
Autor:
Kadri Vural, Scott A. Cabelli, Isoris S. Gergis, Gary L. Bostrup, Philip E. Howard, Donald E. Cooper, Robert B. Bailey, Lester J. Kozlowski, William V. McLevige, W. E. Tennant, Annie Chi-yi Chen
Publikováno v:
Optical Engineering. 33:54
A high-performance 5-μm 640 X 480 HgCdTe/CdTe/Al2O3 infrared focal plane array (FPA) that offers full TV-compatible resolution with excellent sensitivity at temperatures below 120 K has been developed. Mean FPA D* at 95 K and background of 1014 phot
Publikováno v:
IEEE Transactions on Industrial Electronics. :136-139
GaAs bipolar transistors and ring-oscillators were fabricated by ion implantation into VPE structures. The transistor and circuit performance was tested between 25°C and 400°C. Leakage currents determine the useful temperature range. Present GaAs c
Publikováno v:
IEEE Electron Device Letters. 8:121-123
A GaAs enhancement/depletion (E/D) MESFET 1-kbit static RAM has been fabricated on a 2-in GaAs-on-Si substrate. This is the most complex GaAs circuit reported to date for GaAs-on-Si material. The GaAs layer is grown on a
Autor:
V. Sokolov, William V. McLevige
Publikováno v:
IEEE Electron Device Letters. 1:156-158
The use of GaAs FETs as microwave switches is discussed, and the feasibility of such devices for applications requiring ultra low dc power consumption, low insertion loss, and bidirectionality is demonstrated. A discrete SPST switch consisting of two
Autor:
William V. McLevige, W. M. Duncan, Hadis Morkoç, T.J. Drummond, F. H. Doerbeck, William R. Frensley, H.T. Yuan
Publikováno v:
IEEE Electron Device Letters. 3:43-45
Molecular-beam epitaxy (MBE) and ion implantation were used to fabricate GaAs/AlGaAs heterojunction bipolar transistors with buried wide bandgap emitters. Inverted-mode current gains of ∼ 100 were obtained, demonstrating the feasibility of this tec
Publikováno v:
1986 International Electron Devices Meeting.
A functional GaAs enhancement/ deplet on (E/D) 1K-bit SRAM and other digital circuits have been fabricated in a GaAs layer grown by MBE on a silicon substrate. These are the most complex digital circuits reported to date for GaAs-on-Si material. The