Výsledky vyhledávání - "William Sanfins"

Preliminary failure-mode characterization of emerging direct-lead-bonding power module. Comparison with standard wire-bonding interconnection

Autor: Frédéric Richardeau, Michael Chemin, Damien Risaletto, Gael Blondel, William Sanfins, Philippe Baudesson

Publikováno v: Microelectronics Reliability. 55:1956-1960

Direct-lead-bonding (DLB) and wire-bonding, in epoxy-moulded package, are compared in terms of functional characteristics, failure-mode and post-fault high-current capability of a dual-chip power module (PM), with respect to I 2 T and critical energy

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::96bee4216885cd11e4c429e9d8749e17
https://doi.org/10.1016/j.microrel.2015.06.006

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Failure to short-circuit capability of emerging direct-lead-bonding power module. Comparison with standard interconnection. Application for dedicated fail-safe and fault-tolerant converters embedded in critical applications

Autor: Michael Chemin, Damien Risaletto, Philippe Baudesson, Frédéric Richardeau, William Sanfins, Gael Blondel

Publikováno v: 2015 17th European Conference on Power Electronics and Applications (EPE'15 ECCE-Europe).

The Direct-Lead-Bonding (DLB) interconnection appears to be a promising technology for power-module (PM). Nevertheless, the absence of wire-fuse-effect in case of extreme failure, compared to classical wire-bonding, leads authors to rethink fail-safe

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::88e5293a11c874ea158394a80983d1ec
https://doi.org/10.1109/epe.2015.7309355

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