Zobrazeno 1 - 2
of 2
pro vyhledávání: '"William Ramroth"'
Publikováno v:
Composite Structures. 87:382-393
FRP composite panels, with single skin E-glass/vinylester and cored architectures, were subjected to combined compressive and thermal loading. Failure via panel collapse was monitored as a function of thermally induced material degradation at various
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b4777449fbb2fe2051ea9fe26af1019
https://doi.org/10.1016/j.compstruct.2008.02.018
https://doi.org/10.1016/j.compstruct.2008.02.018
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
In recent years, many OSAT (Outsourced Semiconductor Assembly and Test) companies start to explore copper wire bond process, which is believed to be able to reduce the IC packaging cost. Copper wire also shows better electrical performance especially
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2c2471349ba185e4061d088dfdb97bb
https://doi.org/10.1109/eptc.2012.6507163
https://doi.org/10.1109/eptc.2012.6507163