Zobrazeno 1 - 10
of 89
pro vyhledávání: '"William J. Dauksher"'
Publikováno v:
Solar Energy Materials and Solar Cells. 158:98-101
A method of reducing optical losses in the transparent conductive oxides (TCO) used in silicon heterojunction solar cells without compromising with series resistance is described. In the method the thickness of a TCO is reduced two-three times and a
Publikováno v:
2019 IEEE 46th Photovoltaic Specialists Conference (PVSC).
Silicon heterojunction solar cells were manufactured on 40 µm thin substrates using standard industrial manufacturing processes. As the thickness of the substrates goes down, bulk Shockley-Read-Hall recombination is less dominant and surface recombi
Autor:
Joseph Karas, Shujian Xue, Allen Barnett, Mark Francis, William J. Dauksher, Alexander Killam, Anthony Lochtefeld, Tray Moraca, Jongwon Lee
Publikováno v:
2019 IEEE 46th Photovoltaic Specialists Conference (PVSC).
As contrasted with building-applied photovoltaics (BAPV), building-integrated photovoltaics (BIPV) may require utilization of novel encapsulation materials due to specific design applications. Assimilation of electrically conductive adhesives (ECA) h
Publikováno v:
Solar Energy Materials and Solar Cells. 216:110715
Silicon solar cells are now less than 3% absolute from the theoretical efficiency limit. Advanced passivated contact architectures have demonstrated surface saturation current densities close to 1 fA/cm2. We have optimized the thin intrinsic hydrogen
Publikováno v:
Thin Solid Films. 612:243-249
We investigate the optimization of laser ablation with a femtosecond laser for direct and indirect removal of SiNx on alkaline textured c-Si. Our proposed resist-free indirect removal process uses an a-Si:H etch mask and is demonstrated to have a dra
Publikováno v:
2018 IEEE 7th World Conference on Photovoltaic Energy Conversion (WCPEC) (A Joint Conference of 45th IEEE PVSC, 28th PVSEC & 34th EU PVSEC).
Large-scale production of flexible solar cells is paving the way to portable, low cost power devices. Whereas energy conversion of commercial devices is in the range of 5-15 %, our goal is to manufacture low cost, flexible solar cells with efficienci
Autor:
Maxwell Cotton, Stanislau Herasimenka, William J. Dauksher, Stuart Bowden, Emmett Howard, Mark Strnad
Publikováno v:
2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC).
A method of processing ultrathin silicon solar cells by bonding them to a glass carrier is described. The method allows processing large area solar cells on the wafers with down to 10 micron thickness. In the method the rear side of a solar cell is p
Autor:
Tom Tyson, Harsh Jain, Joseph Karas, William J. Dauksher, Krystal Munoz, Antony Aguilar, Jongwon Lee, Lynne Michaelson, Stuart Bowden, Stanislau Herasimenka
Publikováno v:
Web of Science
This paper reports the results of the study comparing various patterning and plating methods for the deposition of Cu electrodes on transparent conductive oxides for silicon heterojunction solar cells. We compared direct electroplating of Cu on diffe
Autor:
Ngoc V. Le, William J. Dauksher, Pawitter J. S. Mangat, Jeffrey H. Baker, K. Gehoski, Kevin J. Nordquist, Diana Convey, S. R. Young, Eric S. Ainley
Publikováno v:
Microelectronic Engineering. 83:929-932
Nano-imprint lithography is attracting attention as a low cost method for printing nanometer-scale geometries and has obtained placement on the International Technology Roadmap for Semiconductors as a potential lithography solution at the 32 and 22nm
Autor:
Ngoc V. Le, William J. Dauksher, Kevin J. Nordquist, Eric S. Ainley, Pawitter J. S. Mangat, K. Gehoski
Publikováno v:
Microelectronic Engineering. 83:839-842
Recent advancements made in step and flash imprint lithography (S-FIL) have enhanced the attractiveness of nanoimprint technology for sub-100nm resolution. Improvements in the area of material dispensing and refinement of the etch barrier itself have