Zobrazeno 1 - 10
of 10
pro vyhledávání: '"William J Grande"'
Autor:
William J. Grande
Publikováno v:
Medical Coatings and Deposition Technologies
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f207bd3504b413a06dd4612af90177c2
https://doi.org/10.1002/9781119308713.ch9
https://doi.org/10.1002/9781119308713.ch9
Autor:
Satish G. Kandlikar, William J. Grande
Publikováno v:
Heat Transfer Engineering. 25:5-16
The increased circuit density on today's computer chips is reaching the heat dissipation limits for air-cooling technology. The direct liquid cooling of chips is being considered as a viable alternative. This paper reviews liquid cooling with interna
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c38cecef07852d2a4fecc96723ac1ca6
https://doi.org/10.1080/01457630490519772
https://doi.org/10.1080/01457630490519772
Autor:
Franak Batliwalla, George Karypis, Timothy W. Behrens, Ward A. Ortmann, Katherine B. Shark, Emily C. Baechler, Patrick M. Gaffney, Peter K. Gregersen, Karl J. Espe, William J. Grande, Vivek Kapur, Karis M. Hughes
Publikováno v:
Proceedings of the National Academy of Sciences. 100:2610-2615
Systemic lupus erythematosus (SLE) is a complex, inflammatory autoimmune disease that affects multiple organ systems. We used global gene expression profiling of peripheral blood mononuclear cells to identify distinct patterns of gene expression that
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::51e8b8b8d81241f8657d2608b4cb591a
https://doi.org/10.1073/pnas.0337679100
https://doi.org/10.1073/pnas.0337679100
Autor:
William J. Grande, Satish G. Kandlikar
Publikováno v:
Heat Transfer Engineering. 24:3-17
This paper provides a roadmap of development in the thermal and fabrication aspects of microchannels as applied in microelectronics and other high heat-flux cooling applications. Microchannels are defined as flow passages that have hydraulic diameter
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e09fe4c80744786fcc372fee4cd5f21
https://doi.org/10.1080/01457630304040
https://doi.org/10.1080/01457630304040
Publikováno v:
Journal of Biomedical Technology and Research. 1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::543653e6568bd4d4e768708e41fb8585
https://doi.org/10.19104/jbtr.2014.108
https://doi.org/10.19104/jbtr.2014.108
Publikováno v:
Journal of Molecular Catalysis A: Chemical. 156:79-84
Several manganese III porphyrins showed significantly increased turnover-numbers for the catalytic epoxidation of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24c84d145002c58a3c16bfc3a0fe141c
https://doi.org/10.1016/s1381-1169(99)00399-4
https://doi.org/10.1016/s1381-1169(99)00399-4
Autor:
William J. Grande, Gary A. Fino
Publikováno v:
ASME 3rd International Conference on Microchannels and Minichannels, Part B cont’d.
A novel technique based on direct thick film writing has been developed for the rapid prototyping of microfluidic devices. The direct writing process is based on pressure driven dispensing of precursor materials through a micro-capillary tip. The pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b1cf00245e133cb039321756a2634db
https://doi.org/10.1115/icmm2005-75059
https://doi.org/10.1115/icmm2005-75059
Autor:
William J. Grande, Satish G. Kandlikar
Publikováno v:
ASME 2nd International Conference on Microchannels and Minichannels.
The increased circuit density on today’s computer chips is reaching the heat dissipation limits for air-cooled technology. Direct liquid cooling of chips is being considered as a viable alternative. This paper reviews liquid cooling in terms of tec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69c26ceeb3cfed0f1f6ef05fa0516d1c
https://doi.org/10.1115/icmm2004-2321
https://doi.org/10.1115/icmm2004-2321
Autor:
William J. Grande
Publikováno v:
1st International Conference on Microchannels and Minichannels.
Microchannel devices with channel widths in the range from one micron to several hundred microns have become increasingly important structures for heat transfer applications. This paper will examine several classes of fabrication technologies that ar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::02d1c2351dd8e53c380bc1dc70c1fe91
https://doi.org/10.1115/icmm2003-1023
https://doi.org/10.1115/icmm2003-1023
Autor:
William J. Grande, Satish G. Kandlikar
Publikováno v:
Technology and Society and Engineering Business Management.
This paper provides a roadmap of development in the thermal and fabrication aspects of microchannels as applied in the microelectronics and other high heat-flux cooling applications. Microchannels are defined as flow passages that have hydraulic diam
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eab3020497cbe1b94788b7236f2f2a74
https://doi.org/10.1115/imece2002-32043
https://doi.org/10.1115/imece2002-32043