Zobrazeno 1 - 10
of 15
pro vyhledávání: '"William D. Sides"'
Publikováno v:
Journal of Electroanalytical Chemistry. 815:8-15
Pd alloys with non-noble transition metals are of interest for various catalytic applications. The electrodeposition of Pd-Zn alloy was investigated from an ammonia citrate electrolyte at neutral pH in this report. Cyclic voltammetry, galvanostatic d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::941e71c4618c6384a085e4b592c37d3c
https://doi.org/10.1016/j.jelechem.2018.03.003
https://doi.org/10.1016/j.jelechem.2018.03.003
Autor:
Qiang Huang, William D. Sides
Publikováno v:
Electrochimica Acta. 266:185-192
The electrodeposition behavior of manganese from the choline chloride/urea based deep eutectic solvent is studied on a rotating disk electrode. Additionally, the effect of the organic additive glycine is analyzed and the characteristics of deposited
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8cc6d5ef979cd2dd8de868315f90a190
https://doi.org/10.1016/j.electacta.2018.01.120
https://doi.org/10.1016/j.electacta.2018.01.120
Autor:
Qiang Huang, William D. Sides
Publikováno v:
Journal of The Electrochemical Society. 165:D568-D573
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a4652e271413f3acb452586716e0e25
https://doi.org/10.1149/2.1011811jes
https://doi.org/10.1149/2.1011811jes
Publikováno v:
Journal of The Electrochemical Society. 163:D715-D721
The effect of dimethylglyoxime on Co electrodeposition was investigated with cyclic voltammetry, chronopotentiometry, quartz microbalance as well as electrochemical impedance. A potential dependent suppression effect was observed at low potential wit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a00fd4e472838af00115c87e0551e29
https://doi.org/10.1149/2.1111613jes
https://doi.org/10.1149/2.1111613jes
Publikováno v:
Journal of Electroanalytical Chemistry. 860:113889
Electrodeposition of rhenium-cobalt (Re-Co) alloys is investigated in water-in-salt electrolyte with a superhigh concentration of lithium chloride. Cyclic and linear sweep voltammetries, potentiostatic deposition, and X-ray fluorescence spectroscopy
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::206a86c1c79b2a5ac2f766dc7a8844bf
https://doi.org/10.1016/j.jelechem.2020.113889
https://doi.org/10.1016/j.jelechem.2020.113889
Publikováno v:
Journal of Applied Physics. 127:085301
The relationship between superconductivity and the film preparation conditions, i.e., the thickness and annealing process, in electrodeposited rhenium (Re) films is studied in order to understand the effect of grain size and impurities on the film's
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8637d1fcac77695847f79b2a96acb659
https://doi.org/10.1063/1.5139909
https://doi.org/10.1063/1.5139909
Autor:
William D. Sides, Qiang Huang
Publikováno v:
Journal of The Electrochemical Society. 167:062509
The use of water-in-salt electrolytes is evaluated for the electrodeposition of metallic ruthenium. The mechanisms of proton reduction inhibition by concentrated LiCl and dilute tetrabutylammonium is evaluated. Concentrated LiCl is found to disrupt t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::304b01260e5bb33552be9e2d806a68e2
https://doi.org/10.1149/1945-7111/ab847e
https://doi.org/10.1149/1945-7111/ab847e
Publikováno v:
ECS Meeting Abstracts. :2116-2116
Electrodeposition of Cu, Co and Re from Water in Salt Electrolytes Qiang Huang,William D. Sides, Shuvodeep De, Yang Hu Department of Chemical and Biological Engineering, University of Alabama, Tuscaloosa, AL 35487 Water-in-salt electrolytes, aqueous
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::262d40022db2fb8f0fbf0ca33b39f17c
https://doi.org/10.1149/ma2019-02/46/2116
https://doi.org/10.1149/ma2019-02/46/2116
Autor:
William D. Sides, Qiang Huang
Publikováno v:
ECS Meeting Abstracts. :1062-1062
As interconnect trench dimensions continue to scale down, the use of electrodeposited copper faces challenges due to its exponentially increasing resistance as trench widths approach and become shorter than the electron mean free path. This limitatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b115140229d878b7483d8653f16473c0
https://doi.org/10.1149/ma2019-01/18/1062
https://doi.org/10.1149/ma2019-01/18/1062
Publikováno v:
ECS Meeting Abstracts. :1111-1111
Electroplated damascene copper has been used for more than 20 years for interconnects in semiconductor and microelectronic industry1. As the structures continue to scale, the coarse grains formed during annealing become increasingly difficult to exte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cde2b2d9eb0309fd00293673221f436e
https://doi.org/10.1149/ma2018-02/33/1111
https://doi.org/10.1149/ma2018-02/33/1111