Zobrazeno 1 - 2
of 2
pro vyhledávání: '"William Courbat"'
Autor:
Grigore Moldovan, William Courbat
Publikováno v:
International Symposium for Testing and Failure Analysis.
The Electron Beam Induced Resistance Change (EBIRCH) technique is becoming more popular for localization of defects in Electrical Failure Analysis (EFA). Whilst EBIRCH is clear and straightforward in the procedure that must be followed for localizati
Autor:
William Courbat, Jörg Jatzkowski
Publikováno v:
EDFA Technical Articles. 21:22-28
A recent trend in semiconductor failure analysis involves combining the use of different tools and techniques in order to acquire more accurate data at a faster rate. This article describes a new workflow that combines FIB, GIS, and nanoprobing, all