Using Unentangled Oligomers To Toughen Materials

Autor: Scott G. Isaacson, Geraud Dubois, Krystelle Lionti, Yusuke Matsuda, Theo J. Frot, Reinhold H. Dauskardt, Willi Volksen

Publikováno v: ACS Applied Materials & Interfaces. 10:27549-27554

Entanglements between polymer chains are responsible for the strength and toughness of polymeric materials. When the chains are too short to form entanglements, the polymer becomes weak and brittle. Here we show that molecular bridging of oligomers i

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ace038ebcff4ff248c950ef8831eee5c
https://doi.org/10.1021/acsami.8b03050

Combined influence of pore size distribution and surface hydrophilicity on the water adsorption characteristics of micro- and mesoporous silica

Autor: Sarmenio Saliba, Geraud Dubois, Teddie Magbitang, Willi Volksen, Patrick Ruch, Bruno Michel

Publikováno v: Microporous and Mesoporous Materials. 226:221-228

Adsorption processes are ubiquitous in nature as well as of great technological importance for gas separation, purification, storage and thermally driven heat pumps. This has led to a strong interest in the fundamental mechanisms governing adsorption

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::5a2916148556337b1fc8eb5a232ad838
https://doi.org/10.1016/j.micromeso.2015.12.029

Independent Control of Adhesive and Bulk Properties of Hybrid Silica Coatings on Polycarbonate

Autor: Krystelle Lionti, Bérangère Toury, Linying Cui, Reinhold H. Dauskardt, Willi Volksen, Geraud Dubois

Publikováno v: ACS Applied Materials & Interfaces
ACS Applied Materials & Interfaces, Washington, D.C. : American Chemical Society, 2013, 5 (21), pp.11276-11280. ⟨10.1021/am403506k⟩

International audience; Transparent polymers are widely used in many 9 applications ranging from automotive windows to micro-10 electronics packaging. However, their intrinsic characteristics, 11 in particular their mechanical properties, are signifi

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::628be4b4a527d1c7efcd8f276f5e2bc8
https://doi.org/10.1021/am403506k

Transforming the P4 process to enhance mechanical and fracture properties of ULKs

Autor: Teddie Magbitang, Krystelle Lionti, Scott G. Isaacson, Geraud Dubois, Reinhold H. Dauskardt, Willi Volksen, Can Wang

Publikováno v: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

Porous ultra-low-k (ULK) dielectrics hold promise for improving microprocessor performance, but these materials suffer from poor mechanical properties [1] and susceptibility to plasma damage during integration [2, 3). The post-porosity plasma protect

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::67620a756a726c44ffa6a1864a544b71
https://doi.org/10.1109/iitc-amc.2016.7507714

Low‐ k Materials: Recent Advances

Autor: Geraud Dubois, Willi Volksen

Publikováno v: Advanced Interconnects for ULSI Technology

From a historical point of view, the search for new low-k and ultra-low-k materials has always been dictated by industrial needs, resulting in a strong connection between fundamental research and technology. Although a variety of potential candidates

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::859496491373931b7aed703838658172
https://doi.org/10.1002/9781119963677.ch1