Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Will Ku"'
Autor:
Li-Tien Tseng, Yu-Hao Chien, Will Ku, Le-Min Zhang, Dapeng Chen, Yun Shichang, Yanmei Kong, Binbin Jiao
Publikováno v:
Journal of Micromechanics and Microengineering. 27:015028
As the costs of packaging and testing account for a substantial portion of microelectromechanical system (MEMS) devices, an effective and convenient characterization method is urgent to be investigated to lower the cost. In this paper, an electrical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7095cbc721ad2acb61fe23b4bd49d9ac
https://doi.org/10.1088/1361-6439/27/1/015028
https://doi.org/10.1088/1361-6439/27/1/015028
Autor:
Lemin Zhang, Binbin Jiao, Will Ku, Li-Tien Tseng, Yanmei Kong, Yu-Hao Chien, Shichang Yun, Dapeng Chen
Publikováno v:
Journal of Micromechanics & Microengineering; Jan2017, Vol. 27 Issue 1, p1-1, 1p