Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Will Hsu"'
Publikováno v:
ITC
Scan based diagnosis can be of great help to guide physical failure analysis, which is critical for the success of silicon debug and yield ramp up. In practice, diagnosis becomes more difficult if scan chain defects and system logic defects co-exist
Autor:
Wu-Tung Cheng, A. Mann, Y.S. Cheng, Chen Liu, Ting-Pu Tai, Sudhakar M. Reddy, Manish Sharma, Will Hsu
Publikováno v:
ITC
In this paper we present practical techniques that enable diagnosis of defective library cells in a failing die. Our technique can handle large industrial designs and practical situations like compressed test patterns with multiple exercising conditi
Autor:
Martin Keim, Yuan-Shih Chen, Chien-Hui Chen, Wu-Tung Cheng, Murali Krishna, Will Hsu, Jan Tofte, Nagesh Tamarapalli, Jun Qian, Jayanth Mekkoth
Publikováno v:
International Symposium for Testing and Failure Analysis.
Manufacturing yield is stable when the technology is mature. But, once in a while, excursions may occur due to variances in the large number of tools, materials, and people involved in the complex IC fabrication. Quickly identifying and correcting th
Autor:
Randy Klingenberg, Nagesh Tamarapalli, Yuan-Shih Chen, Yu Huang, Will Hsu, Janusz Rajski, Wu-Tung Cheng
Publikováno v:
ITC
This paper discusses the challenges associated with diagnosing chain integrity and system logic failures in the production test environment with limited failure information. The following three methods were proposed to enhance diagnosis resolution in
Autor:
Sharma, M., Wu-Tung Cheng, Ting-Pu Tai, Cheng, Y.S., Will Hsu, Chen Liu, Reddy, S.M., Mann, A.
Publikováno v:
2007 IEEE International Test Conference; 2007, p1-10, 10p
Publikováno v:
2007 IEEE International Test Conference; 2007, p1-10, 10p
Autor:
Yu Huang, Wu-Tung Cheng, Nagesh Tamarapalli, Janusz Rajski, Randy Klingenberg, Will Hsu, Yuan-Shih Chen
Publikováno v:
2006 IEEE International Test Conference; 2006, p1-10, 10p