Zobrazeno 1 - 10
of 172
pro vyhledávání: '"Will Conley"'
Autor:
Siqi Luo, Will Conley, James Bonefede, Natallia Karlitskaya, Thomas Yang, david manley, peter Oh, Rajasekhar Rao, marc sells, Josh thornes
Publikováno v:
Photomask Technology 2022.
Autor:
Will Conley, G. G. Padmabandu, Yzzer Roman, Yingbo Zhao, Toufiq Aman, James Bonafede, Emmanuel Rausa, Rasmus Nielsen, Ijen van Mil, Rongkuo Zhao
Publikováno v:
Optical and EUV Nanolithography XXXV.
Autor:
Zhenhai Yao, Lequn Jin, Yuhua Li, Maoqun Jiang, Fabin Huang, Min Fang, Xichen Sheng, Rongkuo Zhao, Michael Crouse, Chris Kaplan, Dongqing Zhang, Dongxiang Shi, Zhonghua Xu, Chaoqun Guo, Pieter Scheijgrond, Xiaoyang Jason Li, Stephen Hsu, Will Conley, Zhen Tang
Publikováno v:
Optical and EUV Nanolithography XXXV.
Autor:
Natalie Kramer, Will Conley
Publikováno v:
Earth Surface Processes and Landforms. 45:2201-2216
Autor:
Jun Ye, Yzzer Roman, Ming-Chun Tien, Dongqing Zhang, Pieter Scheijgrond, Rongkuo Zhao, Zuanyi Li, Xiaoyang Li, Will Conley, Dezheng Sun, Michael Crouse, Jing Su, Xiaolong Zhang, Chen Liu, Vince Plachecki, Howell Rafael C, John He, Hai Li, Stephen Hsu, Xiaobo Xie
Publikováno v:
Optical Microlithography XXXIV.
Over the years, lithography engineers have continued to focus on CD control, overlay and process capability to meet node requirements for yield and device performance. Previous work by Fukuda1 developed a multi-exposure technique at multi-focus posit
Autor:
Paolo Alagna, Kuo-Tai Teng, Omar Zurita, Will Conley, Sam Liu, Josh Thornes, Stephen Hsu, Xiang-ru Xu
Publikováno v:
Optical Microlithography XXXIII.
Over the years, lithography engineers have continued to focus on CD control, overlay and process capability to meet node requirements for yield and device performance. The use of ArFi lithography for advanced process nodes demands challenging pattern
Publikováno v:
Optical Microlithography XXXI.
Use of ArFi lithography requires application-specific tuning to maximize patterning process windows. Previous investigations into the effects of light source bandwidth on imaging performance have provided the foundation for this work by identifying s
Publikováno v:
Optical Microlithography XXXI.
DUV ArF immersion lithography requires patterning budget improvements in the range of 1/10 nm especially for interconnect layers for advanced process nodes. As every angstrom counts, the Cymer XLR 860ix light source has been developed to deliver the
Publikováno v:
Optical Microlithography XXXI.
All chipmakers understand that variability is the enemy of any process and that defectivity reduction is essential to improving yield which translates to profit. Aggressive process window and yield specifications put tight requirements on the DUV lig
Publikováno v:
Handbook of Semiconductor Manufacturing Technology ISBN: 9781315213934
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::53e06f26490ea06a898b45422d86bb91
https://doi.org/10.1201/9781420017663-19
https://doi.org/10.1201/9781420017663-19