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Autor:
Nishant Malik, Maaike M. Visser Taklo, Terje G. Finstad, Wilhelm Dall, Kari Schjølberg-Henriksen, Vishnukanthan Venkatachalapathy, Erik Poppe
Publikováno v:
Superlattices and Microstructures
Properties of aluminum thin films for thermocompression bonding have been studied in terms of surface roughness, grain size, and grain orientation by AFM, SEM, XRD and EBSD for thermocompression bonding. Al films were sputter deposited directly on Si
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d1584d2b54b417b802e800a7397321ed
https://hdl.handle.net/11250/2469521
https://hdl.handle.net/11250/2469521
