Effects of aluminum silicon copper sputtering target processing methods on thin film uniformity and process control during very large scale integrated device fabrication.

Autor: Dunlop, J. A., Pouliquen, B. Y., Drinnon, T. J., Wilcoxen, D. T., Huneke, J. C., Ivanov, I. C., Knorr, D. B., Tracy, D. P.

Publikováno v: Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films; 1993, Vol. 11 Issue 4, p1558-1565, 8p