Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Wil Choon Song"'
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
Multi-chip package (MCP) technology has recently advanced as an alternative packaging solution to enable high performance and power-efficient mobile electronic devices. The wide adoptions of MCP technology are mainly driven by reduced circuit complex
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e8ebfcb5539719a89bdb4e7cf96e54a
https://doi.org/10.1109/eptc.2013.6745707
https://doi.org/10.1109/eptc.2013.6745707
Publikováno v:
2012 4th Asia Symposium on Quality Electronic Design (ASQED).
Multi-Chip Package (MCP) is becoming a customary form of integration in many high performance and advanced electronic devices. The vast adoptions of this technology are mainly contributed by advantages for instance lower power consumption, heterogene
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15d7de4e7f9e6e2f0980a084be3a714d
https://doi.org/10.1109/acqed.2012.6320509
https://doi.org/10.1109/acqed.2012.6320509
Publikováno v:
2012 4th Asia Symposium on Quality Electronic Design (ASQED); 1/ 1/2012, p243-248, 6p
Publikováno v:
2015 IEEE Symposium on Electromagnetic Compatibility & Signal Integrity; 2015, p1-6, 6p
Publikováno v:
2012 4th Asia Symposium on Quality Electronic Design (ASQED); 1/ 1/2012, p1-4, 4p