Investigations on the reliability of lead-free CSP subjected to harsh environments.

Autor: Dudek, R., Doring, R., Michel, B., Petzold, G., Albrecht, J., Wieand, C., Kuhn, S.

Publikováno v: Ninth Intersociety Conference on Thermal & Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543); 2004, p121-121, 1p