Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Wheling Cheng"'
Publikováno v:
Journal of SHM. 12:19-23
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fbb4dfa35f9118ca442a31a3ccc17247
https://doi.org/10.5104/jiep1993.12.2_19
https://doi.org/10.5104/jiep1993.12.2_19
Publikováno v:
2009 IEEE International Symposium on Electromagnetic Compatibility.
In multilayer printed circuit boards (PCBs), vias are commonly used to connect traces on different signal layers. This paper derives the mixed-mode input impedance of differential vias in typical multilayer structures, and proposes to use the input i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::80db865507e317aa7aaad7ae85f4d3f0
https://doi.org/10.1109/isemc.2009.5284629
https://doi.org/10.1109/isemc.2009.5284629
Autor:
James L. Drewniak, Jun Fan, Wheling Cheng, J. Fisher, Matteo Cocchini, Yaojiang Zhang, Jianmin Zhang
Publikováno v:
2008 IEEE International Symposium on Electromagnetic Compatibility.
A 26-layer printed circuit board including several test sites has been analyzed. All the sites have a transition from coupled microstrips to coupled striplines through signal vias. Differential measurements have been performed on some of these test s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::845b19f238d741579572ff9134ec76b8
https://doi.org/10.1109/isemc.2008.4652164
https://doi.org/10.1109/isemc.2008.4652164
Autor:
Jianmin Zhang, Konstantin N. Rozanov, Richard E. DuBroff, David Pommerenke, Zhiping Yang, James L. Drewniak, Wheling Cheng, Marina Y. Koledintseva, Antonio Orlandi, Giulio Antonini
An effective method for extracting parameters of a Debye or a Lorentzian dispersive medium over a wideband frequency range using a genetic algorithm (GA) and a transmission-line model is presented. Scattering parameters (S-parameters) of the transmis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::36793ab028fa68c847ea1c11fca8ec8c
http://hdl.handle.net/11697/2923
http://hdl.handle.net/11697/2923
Autor:
David Pommerenke, James L. Drewniak, R.E. DuBroff, Wheling Cheng, J. Fisher, Sergio Camerlo, Jianmin Zhang, Zhiping Yang
Publikováno v:
2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005..
Characterization and models for multi-gigabit signaling is an important issue in modern digital system. A good physical based model relies on a precise characterization of the test board. Typically, the characterization of the test board is associate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e987a790a87aef836122a503202ebeb
https://doi.org/10.1109/isemc.2005.1513611
https://doi.org/10.1109/isemc.2005.1513611
Autor:
James L. Drewniak, David Pommerenke, Wheling Cheng, Zhiping Yang, Sergio Camerlo, J. Fisher, Jianmin Zhang, Richard E. DuBroff
Publikováno v:
Scopus-Elsevier
Dielectric properties and losses are two critical issues in signal link-path characterization. To obtain the substrate dielectric properties for a planar transmission line, an analytical solution is derived and validated based on a stripline structur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c8c4bd76d7483110019f6a3f2e23fbf4
https://doi.org/10.1109/isemc.2006.1706327
https://doi.org/10.1109/isemc.2006.1706327
Publikováno v:
Proceedings of 1994 IEEE Symposium on VLSI Circuits.
This paper describes an approach to multi-chip module packaging in which a silicon wafer containing active circuits is used as the substrate. Custom interface circuits have been designed for the chip-to-substrate boundary, and series regulation is us
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3d294fa1ededa158fddc39d623e3ccd
https://doi.org/10.1109/vlsic.1994.586209
https://doi.org/10.1109/vlsic.1994.586209
Autor:
Bangalore J. Shanker, Yida Zou, R. Duong, Jie Xue, Wheling Cheng, Ken Hubbard, M. Brillhart, Mudasir Ahmad, S. Priore, Sergio Camerlo
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
This paper briefly presents how silicon integration and advances in packaging technology have enabled higher performance networking products, and is followed by discussions of how a system-level integrated approach is needed to address the challenges
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a3da3b517eb0945ca61cfe96a4b614db
https://doi.org/10.1109/ectc.2005.1441383
https://doi.org/10.1109/ectc.2005.1441383
Publikováno v:
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium.
The radical rise in localized component density has forced designers to utilize extremely high density, high layer count printed circuit boards. These high layer counts make the board more difficult, and more expensive to fabricate, resulting in high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8397e19d5a113b28ca401fae2584ae76
https://doi.org/10.1109/iemt.2002.1032736
https://doi.org/10.1109/iemt.2002.1032736
Autor:
Wheling Cheng, S. Simon Wong
Publikováno v:
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95).
Membrane multi-chip modules (MCMs) have been fabricated to investigate both the electrical design and thermal management of advanced MCM systems. Custom bipolar interface circuits have been interconnected to CMOS VLSI chips, achieving a chip-to-chip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dcc680c515f1a7e63c6cbfdf016e2297
https://doi.org/10.1109/mcmc.1995.512006
https://doi.org/10.1109/mcmc.1995.512006