Zobrazeno 1 - 1
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pro vyhledávání: '"Wenwei Seit"'
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
In the recent years, the industry is moving towards finer, higher density interconnections and better electrical performance from the die to the substrate. The 3D stack assembly using through silicon via (TSVs) has been emerging as a good solution by
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5eb843e0c2e97c6feec7e374b1f0d9e4
https://doi.org/10.1109/eptc47984.2019.9026720
https://doi.org/10.1109/eptc47984.2019.9026720
